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TMS320F28376DPTPT

Texas Instruments

TMS320F28376DPTPT by Texas Instruments

TMS320F28376DPTPT by Texas Instruments is a 32-bit microcontroller with 3 DAC channels, 24-Ch 12-Bit ADC, and 6 timers. Ideal for industrial applications requiring high-speed processing up to 20 MHz, it offers connectivity options like CAN, I2C, SCI, SPI, and USB. With a wide operating temperature range from -40°C to 105°C and low supply voltage of 1.14 V, it ensures reliable performance in various environments.

Median Price

$15.468

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,375 parts In-Stock

1+ parts

$15.468

100+ parts

$13.750

1k+ parts

$10.110

10k+ parts

-

1,375

$15.468

$13.750

$10.110

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,967 parts In-Stock

1+ parts

$14.695

100+ parts

-

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3,967

$14.695

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Vyrian

USA . 4,210 parts In-Stock

1+ parts

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4,210

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ComSIT Distribution GmbH

Germany . 23 parts In-Stock

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23

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,638 parts In-Stock

1+ parts

$13.921

100+ parts

-

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3,638

$13.921

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AZTECH Wire

Italy . 1,029 parts In-Stock

1+ parts

$21.240

100+ parts

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1,029

$21.240

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Parana Technologies

USA . 384 parts In-Stock

1+ parts

$67.552

100+ parts

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384

$67.552

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DigiPath Technology Company

USA . 1,673 parts In-Stock

1+ parts

$74.383

100+ parts

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1,673

$74.383

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ChromeModa Solutions

Germany . 6,102 parts In-Stock

1+ parts

$75.901

100+ parts

$62.239

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6,102

$75.901

$62.239

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IDEA Electronic Components Group

UK . 499 parts In-Stock

1+ parts

$75.901

100+ parts

$72.106

1k+ parts

$68.311

10k+ parts

-

499

$75.901

$72.106

$68.311

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Lixinc

USA . 3,580 parts In-Stock

1+ parts

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3,580

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Overview

Experience unparalleled performance and reliability with the TMS320F28376DPTPT by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge microcontrollers that set the standard for excellence. This versatile product is ideal for a range of applications, offering customers exceptional value and benefits. With advanced features and top-notch quality, the TMS320F28376DPTPT is the perfect choice for those seeking unmatched performance and innovation. Elevate your projects to the next level with this exceptional microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the microcontroller, making it suitable for various applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can function in a wide range of environments, including extreme cold conditions.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital data, enabling it to interface with a variety of sensors and input devices.

ROM Words: 262144

With a ROM capacity of 262144 words, this microcontroller can store a large amount of program code and data, making it suitable for complex applications.

Analog To Digital Convertors: 24-Ch 12-Bit

The 24-channel 12-bit ADCs provide high-resolution analog-to-digital conversion capabilities, allowing the microcontroller to accurately process and analyze analog signals.

No. of Timers: 6

Having 6 timers allows for precise timing and control in various operations and applications, enhancing the overall functionality of the microcontroller.

Connectivity: CAN(2), I2C(2), SCI(4), SPI(3), USB

The multiple connectivity options such as CAN, I2C, SCI, SPI, and USB enable the microcontroller to communicate with a wide range of external devices and systems, expanding its versatility.

Technical Specifications

Microcontrollers TMS320F28376DPTPT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

97

No. of Serial I/Os:

4

No. of Terminals:

176

No. of Timers:

6

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

176128

RAM Words:

172

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

495 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(2), SCI(4), SPI(3), USB"

Peripherals:

"DMA(12), POR, PWM(40), TEMPERATURE SENSOR, TIMER(6), WDT(4)"

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28376DPTPT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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