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TMS320F28375DZWTS

Texas Instruments

TMS320F28375DZWTS by Texas Instruments

TMS320F28375DZWTS by Texas Instruments is a 32-bit microcontroller with 3-Ch 12-Bit DAC and 24-Ch 12-Bit ADC. Ideal for automotive applications, it offers a max clock frequency of 100 MHz, peripherals like DMA(12) and PWM(40), and operates in temperatures ranging from -40 to 125 °C.

Median Price

$21.398

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,054 parts In-Stock

1+ parts

$15.947

100+ parts

$14.175

1k+ parts

$10.423

10k+ parts

-

1,054

$15.947

$14.175

$10.423

-

DigiKey

USA . 270 parts In-Stock

1+ parts

$26.850

100+ parts

$20.052

1k+ parts

-

10k+ parts

-

270

$26.850

$20.052

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,562 parts In-Stock

1+ parts

$15.150

100+ parts

-

1k+ parts

-

10k+ parts

-

4,562

$15.150

-

-

-

Nova Conductors

Japan . 31 parts In-Stock

1+ parts

$17.427

100+ parts

-

1k+ parts

-

10k+ parts

-

31

$17.427

-

-

-

Vyrian

USA . 3,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,117

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 474 parts In-Stock

1+ parts

$13.010

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$13.010

-

-

-

Semicontronic

India . 187 parts In-Stock

1+ parts

$13.010

100+ parts

$12.685

1k+ parts

$12.620

10k+ parts

-

187

$13.010

$12.685

$12.620

-

Corphita

USA . 372 parts In-Stock

1+ parts

$14.352

100+ parts

-

1k+ parts

-

10k+ parts

-

372

$14.352

-

-

-

Continental Prestige Electronics

USA . 2,019 parts In-Stock

1+ parts

$17.427

100+ parts

-

1k+ parts

-

10k+ parts

$17.079

2,019

$17.427

-

-

$17.079

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$17.427

100+ parts

-

1k+ parts

$16.556

10k+ parts

$16.207

1,000

$17.427

-

$16.556

$16.207

Microchip USA

USA . 2,816 parts In-Stock

1+ parts

$44.800

100+ parts

$44.160

1k+ parts

$43.840

10k+ parts

$43.520

2,816

$44.800

$44.160

$43.840

$43.520

Parana Technologies

USA . 1,348 parts In-Stock

1+ parts

$55.875

100+ parts

$5,188.850

1k+ parts

$50.288

10k+ parts

-

1,348

$55.875

$5,188.850

$50.288

-

DigiPath Technology Company

USA . 2,183 parts In-Stock

1+ parts

$61.525

100+ parts

$56.603

1k+ parts

-

10k+ parts

-

2,183

$61.525

$56.603

-

-

ChromeModa Solutions

Germany . 3,888 parts In-Stock

1+ parts

$62.781

100+ parts

$51.480

1k+ parts

-

10k+ parts

-

3,888

$62.781

$51.480

-

-

IDEA Electronic Components Group

UK . 1,172 parts In-Stock

1+ parts

$62.781

100+ parts

$59.642

1k+ parts

$56.503

10k+ parts

-

1,172

$62.781

$59.642

$56.503

-

Argo Parts USA

USA . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,847

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Overview

Unlock the power of innovation with the TMS320F28375DZWTS microcontroller by Texas Instruments. Designed with precision and expertise, this product offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides advanced features and capabilities that ensure optimal performance. With its cutting-edge technology and efficient design, customers can expect exceptional value, benefits, and advantages that will elevate their projects to new heights. Trust Texas Instruments to deliver excellence in every aspect, making the TMS320F28375DZWTS the ultimate choice for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy integration onto circuit boards.

Maximum Supply Voltage:

1.26 V - Suitable for low-power applications.

Package Shape:

SQUARE - Maximizes space utilization on circuit boards.

Bit Size:

32 - Offers high processing capabilities.

DAC Channels:

YES - Enables analog output functionalities.

No. of Terminals:

337 - Provides ample connectivity options.

Package Style:

GRID ARRAY, LOW PROFILE, FINE PITCH - Facilitates efficient heat dissipation.

Minimum Supply Voltage:

1.14 V - Supports energy-efficient operations.

Maximum Operating Temperature:

125 °C - Ideal for demanding industrial environments.

Minimum Operating Temperature:

40 °C - Ensures functionality in extreme conditions.

Terminal Finish:

TIN SILVER COPPER - Enhances electrical conductivity and corrosion resistance.

ADC Channels:

YES - Enables analog input capabilities.

DMA Channels:

YES - Enhances data transfer efficiency.

Terminal Position:

BOTTOM - Facilitates easy board-level integration.

ROM Words:

524288 - Offers ample storage for program code.

Maximum Seated Height:

1.4 mm - Allows for compact device designs.

Digital To Analog Convertors:

3-Ch 12-Bit - Provides accurate analog signal generation.

Width:

16 mm - Compact form factor for space-constrained applications.

Peripherals:

DMA(12), POR, PWM(40), TEMPERATURE SENSOR, TIMER(6), WDT(4) - Versatile peripheral support for diverse functionalities.

Maximum Clock Frequency:

100 MHz - Enables high-speed processing capabilities.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable soldering during assembly processes.

Peak Reflow Temperature °C:

260 - Suitable for lead-free soldering processes.

Length:

16 mm - Ensures a balanced form factor for various applications.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive electronics applications.

Peripheral IC Type:

MICROCONTROLLER, RISC - Features a robust and efficient instruction set architecture.

RAM Bytes:

208896 - Offers ample memory for data storage and processing.

Technology:

CMOS - Provides energy-efficient operation and high-speed performance.

Terminal Form:

BALL - Facilitates easy soldering and connection reliability.

Analog To Digital Convertors:

24-Ch 12-Bit - Enables precise digital conversion of analog signals.

Nominal Supply Voltage:

1.2 V - Ideal for low-power and portable devices.

No. of DMA Channels:

6 - Enhances data transfer efficiency.

PWM Channels:

YES - Allows for precise control of pulse-width modulated signals.

Connectivity:

CAN(2), I2C(2), SCI(4), USB - Enables versatile communication protocols.

ROM Programmability:

FLASH - Allows for flexible program code updates.

Terminal Pitch:

0.8 mm - Enables high-density board integration.

Moisture Sensitivity Level (MSL):

3 - Ensures component reliability during storage and handling.

Speed:

200 rpm - Suitable for a wide range of applications requiring high-speed processing.

On Chip Program ROM Width:

16 - Offers ample storage for program code.

No. of I/O Lines:

169 - Provides versatile input/output capabilities for interfacing with external devices.

Technical Specifications

Microcontrollers TMS320F28375DZWTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of I/O Lines:

169

No. of Terminals:

337

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

208896

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SCI(4), USB

Peripherals:

DMA(12), POR, PWM(40), TEMPERATURE SENSOR, TIMER(6), WDT(4)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28375DZWTS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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