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TMS320F28374DPTPS

Texas Instruments

TMS320F28374DPTPS by Texas Instruments

TMS320F28374DPTPS by Texas Instruments is a 32-bit microcontroller with 176 terminals, featuring 20-Ch 12-Bit ADC and 3-Ch 12-Bit DAC. Ideal for automotive applications, it operates at up to 100 MHz with peripherals like CAN, I2C, and USB connectivity.

Median Price

$19.447

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$19.447

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76

$19.447

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Vyrian

USA . 6,021 parts In-Stock

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Digiode

USA . 4,650 parts In-Stock

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4,650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 740 parts In-Stock

1+ parts

$6.260

100+ parts

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740

$6.260

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Parana Technologies

USA . 1,633 parts In-Stock

1+ parts

$15.451

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-

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$15.832

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1,633

$15.451

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$15.832

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DigiPath Technology Company

USA . 2,030 parts In-Stock

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$17.014

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2,030

$17.014

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ChromeModa Solutions

Germany . 4,824 parts In-Stock

1+ parts

$17.361

100+ parts

$14.236

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4,824

$17.361

$14.236

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

1+ parts

$17.361

100+ parts

$16.493

1k+ parts

$15.625

10k+ parts

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1,614

$17.361

$16.493

$15.625

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Continental Prestige Electronics

USA . 4,201 parts In-Stock

1+ parts

$19.447

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$19.058

4,201

$19.447

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$19.058

Ampacity Inc.

Singapore . 654 parts In-Stock

1+ parts

$22.000

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654

$22.000

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One Stop Electronics

USA . 1,060 parts In-Stock

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$24.000

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1,060

$24.000

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Microchip USA

USA . 2,287 parts In-Stock

1+ parts

$52.250

100+ parts

$51.500

1k+ parts

$51.130

10k+ parts

$50.760

2,287

$52.250

$51.500

$51.130

$50.760

Argo Parts USA

USA . 3,436 parts In-Stock

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Corphita

USA . 1,171 parts In-Stock

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Overview

Unlock the potential of your projects with the TMS320F28374DPTPS by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality microcontrollers that guarantee reliability and performance. Ideal for automotive applications, this 32-bit microcontroller offers an array of peripherals, including ADC and DAC channels, along with connectivity options like CAN and USB. Experience seamless operation and enhanced efficiency with this innovative solution that brings value and benefits to your designs. Trust Texas Instruments to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness.

Maximum Supply Voltage: 1.26 V

A higher maximum supply voltage allows for more flexibility in power supply options.

Bit Size: 32

A 32-bit architecture provides more processing power and capabilities compared to lower bit sizes.

DAC Channels: YES

Having Digital to Analog Converter (DAC) channels allows for conversion of digital signals to analog signals for various applications.

No. of Terminals: 176

With a high number of terminals, this microcontroller can support a wide range of input and output connections.

Maximum Operating Temperature: 125 °C

Being able to operate at high temperatures makes this microcontroller suitable for demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing a Reduced Instruction Set Computing (RISC) architecture can improve speed and efficiency of operations.

RAM Bytes: 176128

With a large RAM capacity, this microcontroller can handle complex tasks and store a significant amount of data.

Analog To Digital Convertors: 20-Ch 12-Bit

Having multiple Analog to Digital Converter (ADC) channels with high resolution enables precise analog signal processing.

Connectivity: CAN(2), I2C(2), SCI(4), USB

Support for various communication protocols like Controller Area Network (CAN), Inter-Integrated Circuit (I2C), Serial Communication Interface (SCI), and Universal Serial Bus (USB) enhances connectivity options.

Technical Specifications

Microcontrollers TMS320F28374DPTPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of I/O Lines:

97

No. of Terminals:

176

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

176128

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SCI(4), USB

Peripherals:

DMA(12), POR, PWM(40), TEMPERATURE SENSOR, TIMER(6), WDT(4)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28374DPTPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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