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TMS320F28069UPNT

Texas Instruments

TMS320F28069UPNT by Texas Instruments

TMS320F28069UPNT by Texas Instruments is a 32-bit microcontroller with 80 terminals and a max clock frequency of 90 MHz. It has various peripherals like PWM, UART, SPI, and USB, making it suitable for applications requiring connectivity and control.

Median Price

$22.210

Lifecycle Status

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7

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1k+

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Texas Instruments

USA . 1,251 parts In-Stock

1+ parts

$13.370

100+ parts

$11.678

1k+ parts

$8.054

10k+ parts

-

1,251

$13.370

$11.678

$8.054

-

Mouser Electronics

USA . 78 parts In-Stock

1+ parts

$22.210

100+ parts

$16.680

1k+ parts

$14.690

10k+ parts

-

78

$22.210

$16.680

$14.690

-

DigiKey

USA . 35 parts In-Stock

1+ parts

$22.210

100+ parts

$16.678

1k+ parts

$14.458

10k+ parts

-

35

$22.210

$16.678

$14.458

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,041 parts In-Stock

1+ parts

$12.702

100+ parts

-

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4,041

$12.702

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Nova Conductors

Japan . 100 parts In-Stock

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$14.014

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-

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100

$14.014

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Vyrian

USA . 8,988 parts In-Stock

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8,988

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Rebound Electronics

UK . 85 parts In-Stock

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85

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Ampacity Inc.

Singapore . 99 parts In-Stock

1+ parts

$11.360

100+ parts

-

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-

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99

$11.360

-

-

-

Corphita

USA . 4,174 parts In-Stock

1+ parts

$12.033

100+ parts

-

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-

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4,174

$12.033

-

-

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Corohmni

South Africa . 259 parts In-Stock

1+ parts

$12.886

100+ parts

-

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259

$12.886

-

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Continental Prestige Electronics

USA . 6,788 parts In-Stock

1+ parts

$14.014

100+ parts

-

1k+ parts

-

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$13.734

6,788

$14.014

-

-

$13.734

Modulus Dynamics

Lithuania . 500 parts In-Stock

1+ parts

$15.555

100+ parts

$15.400

1k+ parts

$14.933

10k+ parts

-

500

$15.555

$15.400

$14.933

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Component Stockers USA

USA . 2,249 parts In-Stock

1+ parts

$16.660

100+ parts

$14.650

1k+ parts

$8.640

10k+ parts

-

2,249

$16.660

$14.650

$8.640

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$20.887

100+ parts

$19.007

1k+ parts

$17.127

10k+ parts

-

3,000

$20.887

$19.007

$17.127

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Semicontronic

India . 552 parts In-Stock

1+ parts

$24.730

100+ parts

$24.112

1k+ parts

$23.988

10k+ parts

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552

$24.730

$24.112

$23.988

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Microchip USA

USA . 3,171 parts In-Stock

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$49.728

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3,171

$49.728

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Parana Technologies

USA . 2,275 parts In-Stock

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$71.538

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2,275

$71.538

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DigiPath Technology Company

USA . 2,377 parts In-Stock

1+ parts

$78.772

100+ parts

$72.471

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2,377

$78.772

$72.471

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ChromeModa Solutions

Germany . 3,964 parts In-Stock

1+ parts

$80.380

100+ parts

$65.912

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-

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3,964

$80.380

$65.912

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IDEA Electronic Components Group

UK . 2,056 parts In-Stock

1+ parts

$80.380

100+ parts

$76.361

1k+ parts

$72.342

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2,056

$80.380

$76.361

$72.342

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QUARKTWIN TECHNOLOGY LTD

USA . 14,106 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Lixinc

USA . 7,115 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Argo Parts USA

USA . 1,135 parts In-Stock

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Perfect Parts

USA . 409 parts In-Stock

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409

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$2.935

1k+ parts

$2.935

10k+ parts

$2.935

250

-

$2.935

$2.935

$2.935

Overview

Looking for a high-quality microcontroller that delivers exceptional performance? Look no further than the TMS320F28069UPNT by Texas Instruments. With its advanced technology and CMOS design, this microcontroller offers unparalleled speed and connectivity options including CAN, I2C, SPI, UART, and USB. Whether you need it for industrial applications or low power mode, this product has got you covered. Its compact size and low profile make it easy to integrate into any project. Trust Texas Instruments, a renowned manufacturer known for their innovative solutions, and experience the value and benefits of the TMS320F28069UPNT for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the microcontroller, ensuring longevity and ease of installation.

Surface Mount: YES

Allows for easy and compact integration into electronic devices, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.995 V

Enables efficient power usage, minimizing energy consumption and extending battery life.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and durability, making it suitable for automotive applications.

Package Shape: SQUARE

Features a square-shaped package design, ensuring compatibility with various mounting configurations.

Bit Size: 32

Provides a high-performance processing capability, allowing for complex computations and advanced functionality.

No. of Terminals: 80

Offers a sufficient number of terminals for connecting to other components, enabling versatile integration into different systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Facilitates easy and precise mounting onto circuit boards, ensuring optimum electrical connections.

Minimum Supply Voltage: 1.71 V

Allows for operation at lower voltage levels, offering flexibility in power supply options.

Maximum Operating Temperature: 105 °C

Withstands high operating temperatures, ensuring reliable performance even in demanding environments.

CPU Family: TMS320

Belongs to the TMS320 family of microcontrollers, known for their powerful processing capabilities and extensive feature set.

No. of External Interrupts: 3

Supports external interrupt signals, enabling the microcontroller to respond to external events and improve responsiveness.

Minimum Operating Temperature: -40 °C

Functions reliably even in extremely cold temperatures, making it suitable for outdoor and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent corrosion resistance and ensures reliable electrical connections over time.

ADC Channels: YES

Integrates analog-to-digital converters, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Includes direct memory access channels, enhancing data transfer efficiency and reducing CPU workload.

Terminal Position: QUAD

Offers a quad terminal configuration, providing multiple options for connecting external components.

ROM Words: 131072

Provides ample non-volatile memory for storing program code and permanent data.

Maximum Seated Height: 1.6 mm

Features a low-profile design, enabling easy integration into slim devices or space-constrained applications.

Width: 12 mm

Compact width dimension, facilitating installation in tight spaces or densely packed circuit boards.

Boundary Scan: YES

Supports boundary scan functionality, simplifying debugging, testing, and manufacturing processes.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

Includes a wide range of integrated peripherals, enabling enhanced functionality and versatility.

Maximum Clock Frequency: 90 MHz

Provides fast processing speed, allowing for rapid execution of instructions and efficient data processing.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow soldering processes during manufacturing, ensuring robustness and reliability.

Length: 12 mm

Compact length dimension, enabling space-saving integration in small-sized devices or densely populated circuit boards.

Temperature Grade: INDUSTRIAL

Meets industrial-grade temperature requirements, designed to withstand harsh and demanding operating conditions.

Peripheral IC Type: MICROCONTROLLER

Incorporates a microcontroller core, allowing for programmable and customizable functionality.

RAM Bytes: 102400

Provides ample volatile memory for storing data and temporary variables during program execution.

Technology: CMOS

Utilizes complementary metal-oxide-semiconductor technology, ensuring low power consumption and high noise immunity.

Terminal Form: GULL WING

Features gull-wing terminals, enabling easy and secure soldering onto circuit boards.

Analog To Digital Convertors: 12-Ch 12-Bit

Integrates 12 analog-to-digital converters with 12-bit resolution, enabling accurate measurement and conversion of analog signals.

Maximum Supply Current: 245 mA

Allows for high current delivery, ensuring sufficient power for driving components and peripherals.

Nominal Supply Voltage: 1.8 V

Provides a stable supply voltage, ensuring reliable operation and compatibility with a wide range of power sources.

No. of DMA Channels: 6

Supports up to 6 direct memory access channels, enhancing data transfer efficiency and improving system performance.

PWM Channels: YES

Offers pulse-width modulation channels, allowing for precise control of motors, LEDs, and other peripherals.

Connectivity: CAN, I2C, SPI(2), UART(2), USB

Provides multiple connectivity options, facilitating communication with other devices and systems.

ROM Programmability: FLASH

Allows for program code to be written and rewritten, ensuring flexibility and ease of firmware updates.

Terminal Pitch: 0.5 mm

Features a small terminal pitch, enabling precise soldering and reducing the space required for connections.

Format: FLOATING POINT

Supports floating-point data representation, enabling more precise mathematical calculations and data processing.

Moisture Sensitivity Level (MSL): 3

Complies with MSL level 3 standards, indicating a longer shelf-life and improved reliability during assembly and rework processes.

Speed: 90 rpm

Suitable for applications requiring precise control of rotational speed, such as motor control or robotics.

Low Power Mode: YES

Offers a low power mode, reducing power consumption during idle or low activity periods, prolonging battery life and reducing energy costs.

On Chip Program ROM Width: 16

Provides a wide data bus for accessing program code from on-chip ROM, enabling faster instruction execution and data retrieval.

No. of I/O Lines: 40

Equipped with 40 input/output lines, providing versatile connectivity options for interfacing with external components and peripherals.

Technical Specifications

Microcontrollers TMS320F28069UPNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

90 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMS320F28069UPNT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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