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TMS320F28068UPZT

Texas Instruments

TMS320F28068UPZT by Texas Instruments

TMS320F28068UPZT by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 102400 RAM bytes. It operates at a speed of 90 rpm, suitable for applications requiring high processing power in fields like industrial automation and motor control. The package style is flatpack, making it ideal for surface mount assembly with a terminal pitch of 0.5 mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,658 parts In-Stock

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8,658

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Digiode

USA . 4,876 parts In-Stock

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4,876

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Distributors (Availability)

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AZTECH Wire

Italy . 241 parts In-Stock

1+ parts

$5.794

100+ parts

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241

$5.794

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One Stop Electronics

USA . 305 parts In-Stock

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$8.000

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305

$8.000

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Parana Technologies

USA . 161 parts In-Stock

1+ parts

$21.901

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$22.395

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161

$21.901

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$22.395

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DigiPath Technology Company

USA . 209 parts In-Stock

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$24.116

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209

$24.116

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ChromeModa Solutions

Germany . 2,989 parts In-Stock

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$24.608

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$20.179

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2,989

$24.608

$20.179

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IDEA Electronic Components Group

UK . 2,039 parts In-Stock

1+ parts

$24.608

100+ parts

$23.378

1k+ parts

$22.147

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2,039

$24.608

$23.378

$22.147

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Corphita

USA . 3,733 parts In-Stock

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Microchip USA

USA . 2,976 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320F28068UPZT microcontroller by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments has once again delivered a game-changing product that is sure to meet and exceed your expectations. Designed for a wide range of applications, this microcontroller offers unparalleled value, benefits, and advantages to customers looking to streamline their processes and enhance their products. Experience seamless performance and unmatched efficiency with the TMS320F28068UPZT microcontroller - the perfect choice for all your technological needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and enabling automated assembly processes.

Package Shape: SQUARE

The square package shape helps in straightforward placement and orientation on the PCB, simplifying the design process.

Bit Size: 32

32-bit architecture enables the microcontroller to handle complex computations and data processing efficiently.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows flexibility in system design and operation, accommodating different power requirements.

No. of Terminals: 100

Having 100 terminals provides ample connection points for interfacing with other components, peripherals, and external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers mechanical robustness and ease of handling during assembly and mounting stages.

CPU Family: TMS320

Part of the TMS320 CPU family, known for its high performance and efficient signal processing capabilities, making it ideal for applications requiring real-time computation.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Terminal Position: QUAD

Quad terminal configuration simplifies PCB layout and routing, enhancing signal integrity and minimizing interference.

ROM Words: 131072

With 131072 ROM words, the microcontroller offers sufficient memory capacity for storing program instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering without damaging the microcontroller during assembly processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can withstand high-temperature soldering processes, ensuring reliable solder joints.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it integrates a wide range of peripherals and I/O capabilities, reducing the external component count and simplifying system design.

RAM Bytes: 102400

The ample RAM capacity of 102400 bytes allows for efficient data storage and manipulation during program execution, enhancing overall system performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels, making the microcontroller energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and inspection processes, ensuring reliable electrical connections and robust mechanical anchoring.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the program code, enhancing flexibility and adaptability in embedded applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the microcontroller offers high-density packaging and compatibility with modern PCB design standards, enabling compact and miniaturized layouts.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring long-term reliability in humid environments.

Speed: 90 rpm

Operating at a speed of 90 rpm, the microcontroller delivers fast and responsive performance for real-time computing tasks and data processing operations.

Technical Specifications

Microcontrollers TMS320F28068UPZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

TMS320

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

90 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320F28068UPZT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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