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TMS320F28068UPZPS

Texas Instruments

TMS320F28068UPZPS by Texas Instruments

TMS320F28068UPZPS by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 102400 RAM bytes. It operates at a speed of 90 rpm, suitable for applications requiring high processing power in automotive and industrial control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 667 parts In-Stock

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Digiode

USA . 287 parts In-Stock

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AZTECH Wire

Italy . 782 parts In-Stock

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$5.247

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Parana Technologies

USA . 863 parts In-Stock

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$15.386

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$15.774

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863

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ChromeModa Solutions

Germany . 4,639 parts In-Stock

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$17.288

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$14.176

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IDEA Electronic Components Group

UK . 1,516 parts In-Stock

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$17.288

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$16.424

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$15.559

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One Stop Electronics

USA . 686 parts In-Stock

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$30.000

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Corphita

USA . 2,546 parts In-Stock

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Microchip USA

USA . 1,683 parts In-Stock

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DigiPath Technology Company

USA . 955 parts In-Stock

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$15.587

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$15.587

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Overview

Unlock the power of innovation with the TMS320F28068UPZPS microcontroller by Texas Instruments. Built with precision and reliability, this cutting-edge device offers unmatched performance in a compact package. Ideal for a wide range of applications, from industrial automation to automotive systems, this microcontroller delivers unparalleled speed and efficiency. Experience the seamless integration and advanced features that only Texas Instruments can provide, setting new standards in quality and value. Elevate your projects to new heights with the TMS320F28068UPZPS and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, ensuring longevity and reliability in various operating environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Bit Size: 32

With a 32-bit architecture, this microcontroller provides enhanced processing capabilities for handling complex tasks and calculations efficiently.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages (1.8V and 3.3V) allows for flexibility in designing power-efficient systems and compatibility with various components.

No. of Terminals: 100

Having 100 terminals offers ample connectivity options for interfacing with other devices, peripherals, and sensors, making it versatile for different applications.

Package Style (Meter): FLATPACK

The flatpack package style provides a compact and space-saving design, ideal for applications where board space is limited.

CPU Family: TMS320

Part of the TMS320 family, known for high performance and reliability in embedded processing, ensuring optimal performance for various applications.

ROM Words: 131072

With a large ROM capacity of 131072 words, the microcontroller can store a significant amount of program data, allowing for complex code execution and versatility.

Maximum Time At Peak Reflow Temperature (s): 30

Having a maximum reflow time of 30 seconds at peak temperature ensures proper soldering and reliability during manufacturing assembly.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller with integrated peripherals, reducing the need for additional components and simplifying system design.

RAM Bytes: 102400

With a generous RAM capacity of 102400 bytes, the microcontroller can efficiently handle data processing and storage requirements for complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in various operating conditions.

ROM Programmability: FLASH

Featuring FLASH ROM programmability, allowing for easy and quick updates to the firmware without needing to replace the entire chip, enabling flexibility and versatility.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the microcontroller can withstand moderate exposure to moisture during storage and assembly processes, ensuring product reliability in various environments.

Speed: 90 rpm

Operating at a speed of 90 rpm, the microcontroller can efficiently perform tasks and processes in real-time, meeting the performance requirements of demanding applications.

Technical Specifications

Microcontrollers TMS320F28068UPZPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

TMS320

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

90 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320F28068UPZPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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