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TMS320F28068MPNT

Texas Instruments

TMS320F28068MPNT by Texas Instruments

TMS320F28068MPNT by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 102400 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for industrial applications requiring CAN, I2C, SPI(2), UART(2), USB connectivity and low power mode at a max clock frequency of 90 MHz.

Median Price

$14.653

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,627 parts In-Stock

1+ parts

$14.653

100+ parts

$12.799

1k+ parts

$8.827

10k+ parts

-

2,627

$14.653

$12.799

$8.827

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,267 parts In-Stock

1+ parts

$13.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2,267

$13.920

-

-

-

Vyrian

USA . 5,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,573

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 683 parts In-Stock

1+ parts

$13.188

100+ parts

-

1k+ parts

-

10k+ parts

-

683

$13.188

-

-

-

AZTECH Wire

Italy . 784 parts In-Stock

1+ parts

$21.670

100+ parts

-

1k+ parts

-

10k+ parts

-

784

$21.670

-

-

-

Microchip USA

USA . 2,985 parts In-Stock

1+ parts

$40.690

100+ parts

$40.110

1k+ parts

$39.820

10k+ parts

$39.530

2,985

$40.690

$40.110

$39.820

$39.530

Parana Technologies

USA . 598 parts In-Stock

1+ parts

$73.724

100+ parts

-

1k+ parts

-

10k+ parts

-

598

$73.724

-

-

-

ChromeModa Solutions

Germany . 6,344 parts In-Stock

1+ parts

$82.836

100+ parts

$67.926

1k+ parts

-

10k+ parts

-

6,344

$82.836

$67.926

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IDEA Electronic Components Group

UK . 1,362 parts In-Stock

1+ parts

$82.836

100+ parts

$78.694

1k+ parts

$74.552

10k+ parts

-

1,362

$82.836

$78.694

$74.552

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DigiPath Technology Company

USA . 2,118 parts In-Stock

1+ parts

-

100+ parts

$74.685

1k+ parts

-

10k+ parts

-

2,118

-

$74.685

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Overview

Unlock the power of innovation with the TMS320F28068MPNT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their microcontrollers. This versatile product is ideal for a wide range of applications, offering customers unmatched value and benefits. Experience seamless connectivity with CAN, I2C, SPI, UART, and USB options, along with advanced features like BOR, DMA, POR, PWM, and more. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for microcontrollers as it provides good protection for the internal components while keeping the overall package lightweight.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating a wide range of applications.

No. of Terminals: 80

Having a high number of terminals enables more connectivity options and functionality in the microcontroller.

ADC Channels: YES

The presence of Analog to Digital Converters (ADC) allows the microcontroller to interact with analog signals, making it suitable for a variety of sensor applications.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

A wide range of peripherals like timers, PWM channels, and temperature sensors provide enhanced capabilities and flexibility in designing applications with this microcontroller.

Connectivity: CAN, I2C, SPI(2), UART(2), USB

Multiple communication interfaces like CAN, I2C, SPI, UART, and USB enable seamless integration with various devices and systems, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers TMS320F28068MPNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

90 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMS320F28068MPNT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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