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TMS320F28065PZPQ

Texas Instruments

TMS320F28065PZPQ by Texas Instruments

TMS320F28065PZPQ by Texas Instruments is a 32-bit microcontroller with 80 MHz clock frequency, 102400 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level, CAN, I2C, SCI(2), SPI(2), UART(2), USB connectivity options, and low power mode support.

Median Price

$18.475

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$18.475

100+ parts

-

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700

$18.475

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Vyrian

USA . 7,072 parts In-Stock

1+ parts

-

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7,072

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Digiode

USA . 4,135 parts In-Stock

1+ parts

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4,135

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,234 parts In-Stock

1+ parts

$4.000

100+ parts

-

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1,234

$4.000

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$15.977

100+ parts

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271

$15.977

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Parana Technologies

USA . 1,581 parts In-Stock

1+ parts

$45.034

100+ parts

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1,581

$45.034

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DigiPath Technology Company

USA . 1,505 parts In-Stock

1+ parts

$49.588

100+ parts

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1k+ parts

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1,505

$49.588

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ChromeModa Solutions

Germany . 4,623 parts In-Stock

1+ parts

$50.600

100+ parts

$41.492

1k+ parts

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4,623

$50.600

$41.492

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IDEA Electronic Components Group

UK . 533 parts In-Stock

1+ parts

$50.600

100+ parts

$48.070

1k+ parts

$45.540

10k+ parts

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533

$50.600

$48.070

$45.540

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Component Stockers USA

USA . 694 parts In-Stock

1+ parts

$99.990

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694

$99.990

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Corphita

USA . 4,393 parts In-Stock

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4,393

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Overview

Experience the power of innovation with the TMS320F28065PZPQ microcontroller by Texas Instruments. Designed with precision and quality in mind, this cutting-edge device offers a wide range of applications in various industries, providing customers with unparalleled value and benefits. With advanced features such as high-speed processing, multiple connectivity options, and low power consumption, this microcontroller is the perfect choice for your next project. Trust Texas Instruments to deliver reliable and efficient solutions for all your electronic needs. Elevate your designs with the TMS320F28065PZPQ and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.995V

Allows for flexibility in power supply options and operation within a safe voltage range.

No. of Terminals: 100

Offers a sufficient number of terminals for connecting to external devices and peripherals.

RAM Bytes: 102400

Generous amount of RAM for storing and processing data efficiently.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast processing speed and performance.

Connectivity: CAN, I2C, SCI(2), SPI(2), UART(2), USB

Multiple connectivity options allow for easy integration with various communication protocols and devices.

Technical Specifications

Microcontrollers TMS320F28065PZPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

2KB OF OTP ROM

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

54

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA, POR, PWM(16), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28065PZPQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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