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TMS320F28064UPNT

Texas Instruments

TMS320F28064UPNT by Texas Instruments

TMS320F28064UPNT by Texas Instruments is a 32-bit microcontroller with 102400 RAM Bytes and 65536 ROM Words. It operates at a speed of 90 rpm, suitable for applications requiring high processing power in industries like automotive and industrial automation. The package style is flatpack with 80 terminals, making it ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,833 parts In-Stock

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3,833

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Vyrian

USA . 1,966 parts In-Stock

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1,966

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Distributors (Availability)

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AZTECH Wire

Italy . 292 parts In-Stock

1+ parts

$12.092

100+ parts

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292

$12.092

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One Stop Electronics

USA . 1,556 parts In-Stock

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$35.000

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1,556

$35.000

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Parana Technologies

USA . 2,322 parts In-Stock

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$76.870

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2,322

$76.870

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DigiPath Technology Company

USA . 2,141 parts In-Stock

1+ parts

$84.644

100+ parts

$77.872

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2,141

$84.644

$77.872

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ChromeModa Solutions

Germany . 4,033 parts In-Stock

1+ parts

$86.371

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$70.824

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4,033

$86.371

$70.824

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$86.371

100+ parts

$82.052

1k+ parts

$77.734

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1,078

$86.371

$82.052

$77.734

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Microchip USA

USA . 2,843 parts In-Stock

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2,843

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Corphita

USA . 706 parts In-Stock

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706

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Overview

Unlock the power of cutting-edge technology with the TMS320F28064UPNT by Texas Instruments. As a leader in the microcontroller industry, Texas Instruments delivers top-quality products that meet the highest standards. This microcontroller offers unparalleled performance and versatility for a wide range of applications. Experience seamless integration, high-speed processing, and reliable operation with the TMS320F28064UPNT. Elevate your projects and stay ahead of the competition with this innovative solution that provides exceptional value and benefits to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller easy to handle and suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Package Shape: SQUARE

The square shape of the package makes it easier to design and layout on a PCB, optimizing space and improving overall functionality.

Bit Size: 32

A 32-bit architecture provides higher processing power and performance compared to lower bit sizes, making the microcontroller suitable for complex tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in design and compatibility with different systems and components.

No. of Terminals: 80

Having a higher number of terminals provides more connectivity options and expansion possibilities for peripherals and external devices.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact form factor, ideal for space-constrained designs and applications.

CPU Family: TMS320

The TMS320 CPU family is known for its performance and reliability, ensuring efficient operation and processing capabilities for the microcontroller.

ROM Words: 65536

With a large ROM capacity, the microcontroller can store a significant amount of program data and instructions, essential for complex applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures quick and effective soldering during assembly, maintaining the integrity and reliability of the connections.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with various integrated peripherals, this product offers a comprehensive solution for a wide range of applications.

RAM Bytes: 102400

A large RAM capacity allows for efficient data storage and manipulation, enhancing the performance and multitasking capabilities of the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in different operating environments.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable connections on the PCB, ensuring stability and durability over extended periods of use.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient updating and reprogramming of firmware, providing flexibility and adaptability for future changes.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller has a moderate level of moisture sensitivity, suitable for standard reflow soldering processes without requiring special handling.

Speed: 90 rpm

With a speed of 90 rpm, this microcontroller can efficiently process tasks and data, enabling smooth operation and responsiveness in real-time applications.

Technical Specifications

Microcontrollers TMS320F28064UPNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

TMS320

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

90 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320F28064UPNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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