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TMS320F28063UPFPS

Texas Instruments

TMS320F28063UPFPS by Texas Instruments

TMS320F28063UPFPS by Texas Instruments is a 32-bit microcontroller with 80 terminals, 65536 ROM words, and 69632 RAM bytes. It features FLASH ROM programmability and operates at a speed of 90 rpm. This microcontroller is commonly used in applications requiring high processing power and real-time control capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,330 parts In-Stock

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6,330

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Digiode

USA . 692 parts In-Stock

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692

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Distributors (Availability)

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AZTECH Wire

Italy . 374 parts In-Stock

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$15.202

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374

$15.202

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One Stop Electronics

USA . 151 parts In-Stock

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$31.000

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151

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Parana Technologies

USA . 1,186 parts In-Stock

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$53.157

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$53.157

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DigiPath Technology Company

USA . 1,015 parts In-Stock

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$58.532

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1,015

$58.532

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ChromeModa Solutions

Germany . 4,942 parts In-Stock

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$59.727

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$48.976

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4,942

$59.727

$48.976

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IDEA Electronic Components Group

UK . 723 parts In-Stock

1+ parts

$59.727

100+ parts

$56.741

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$53.754

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723

$59.727

$56.741

$53.754

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Corphita

USA . 4,916 parts In-Stock

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Microchip USA

USA . 1,659 parts In-Stock

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Overview

Unlock endless possibilities with the TMS320F28063UPFPS microcontroller by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that pushes boundaries. Ideal for a wide range of applications, this microcontroller offers unparalleled performance, efficiency, and versatility. With its advanced features and innovative design, the TMS320F28063UPFPS is the perfect choice for customers looking to elevate their projects to the next level. Experience the value, benefits, and advantages that this exceptional product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving time and effort during production.

Bit Size: 32

With a bit size of 32, this microcontroller provides high processing power and efficiency for handling complex tasks and calculations.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in designing and integrating the microcontroller into different systems.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options for interfacing with various external components and peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers a compact form factor for space-saving designs and efficient PCB layout.

CPU Family: TMS320

Being part of the TMS320 CPU family ensures compatibility with existing TMS320-based systems and tools, simplifying development and integration.

ROM Words: 65536

With a ROM size of 65536 words, the microcontroller has sufficient memory capacity to store program instructions and data.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures reliable soldering and manufacturing processes.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals simplifies system design and reduces the need for external components, saving cost and board space.

RAM Bytes: 69632

With 69632 bytes of RAM, the microcontroller can efficiently handle data processing and storage requirements for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller suitable for battery-powered and noise-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical support and easy soldering for reliable and robust connections on the PCB.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast updates to the firmware and software, enabling flexibility and customization in the field.

Terminal Pitch: 0.5 mm

Having a terminal pitch of 0.5 mm offers high density and compatibility with standard PCB manufacturing processes for ease of assembly.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the microcontroller can withstand moderate exposure to moisture during storage and handling, ensuring reliability in various environments.

Speed: 90 rpm

Operating at a speed of 90 rpm, the microcontroller can deliver fast and responsive performance for time-critical applications.

Technical Specifications

Microcontrollers TMS320F28063UPFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

TMS320

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

90 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320F28063UPFPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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