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TMS320F28054MPNQ

Texas Instruments

TMS320F28054MPNQ by Texas Instruments

TMS320F28054MPNQ by Texas Instruments is a 32-bit microcontroller with 16-Ch 12-Bit ADC, 14 PWM channels, and CAN/I2C/SCI/SPI connectivity. Ideal for automotive applications due to AEC-Q100 screening, operating at -40 to 125 °C with low profile FLATPACK package. CPU Family C28X offers high-speed processing up to 30 MHz for various automotive control systems.

Median Price

$15.896

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,465 parts In-Stock

1+ parts

$15.896

100+ parts

$13.885

1k+ parts

$9.576

10k+ parts

-

1,465

$15.896

$13.885

$9.576

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,137 parts In-Stock

1+ parts

$15.101

100+ parts

-

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1,137

$15.101

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Vyrian

USA . 3,729 parts In-Stock

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-

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3,729

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Distributors (Availability)

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Corphita

USA . 4,938 parts In-Stock

1+ parts

$14.306

100+ parts

-

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4,938

$14.306

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$44.192

100+ parts

$40.215

1k+ parts

$36.237

10k+ parts

-

500

$44.192

$40.215

$36.237

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Parana Technologies

USA . 987 parts In-Stock

1+ parts

$61.196

100+ parts

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987

$61.196

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DigiPath Technology Company

USA . 2,187 parts In-Stock

1+ parts

$67.384

100+ parts

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2,187

$67.384

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IDEA Electronic Components Group

UK . 2,329 parts In-Stock

1+ parts

$68.759

100+ parts

$65.321

1k+ parts

$61.883

10k+ parts

-

2,329

$68.759

$65.321

$61.883

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ChromeModa Solutions

Germany . 641 parts In-Stock

1+ parts

$68.759

100+ parts

$56.382

1k+ parts

-

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641

$68.759

$56.382

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Microchip USA

USA . 1,759 parts In-Stock

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1,759

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Kepictronics

USA . 1,200 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320F28054MPNQ by Texas Instruments. This top-of-the-line microcontroller offers unparalleled quality and reliability, thanks to its industry-leading manufacturer. With a wide range of applications in automotive and industrial settings, this product provides customers with unmatched value, benefits, and advantages. Say goodbye to limitations and embrace the future with the TMS320F28054MPNQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 1.995 V

Allows for efficient power usage and compatibility with a wide range of power sources.

Minimum Operating Temperature: -40 °C

Allows the microcontroller to function reliably in cold environments, making it suitable for various applications.

Peripheral IC Type: MICROCONTROLLER

Indicates that this product is specifically designed for microcontroller applications, ensuring optimized performance and functionality.

RAM Bytes: 16384

Provides ample memory for storing data and running programs, making the microcontroller suitable for complex tasks.

Analog To Digital Convertors: 16-Ch 12-Bit

Enables the microcontroller to efficiently convert analog signals to digital data, making it versatile for sensor interfacing and signal processing.

Connectivity: CAN, I2C, SCI(3), SPI

Offers various communication interfaces, allowing the microcontroller to easily connect with other devices and peripherals, enhancing its versatility.

Technical Specifications

Microcontrollers TMS320F28054MPNQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

1-CH BUFFRED DAC IS THERE

Address Bus Width:

0

Bit Size:

32

CPU Family:

C28X

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

42

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(3), SPI

Peripherals:

BOR, COMPARATOR(7), POR, PWM(14), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28054MPNQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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