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TMS320F28034PAGQR

Texas Instruments

TMS320F28034PAGQR by Texas Instruments

TMS320F28034PAGQR by Texas Instruments is a 32-bit microcontroller with 64 terminals, operating at up to 30 MHz. Ideal for automotive applications, it features 14-Ch 12-Bit ADCs, 18 PWM channels, and connectivity options like CAN, I2C, LIN, SCI, and SPI.

Median Price

$8.267

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,505 parts In-Stock

1+ parts

$8.267

100+ parts

$6.740

1k+ parts

$4.493

10k+ parts

-

2,505

$8.267

$6.740

$4.493

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,120 parts In-Stock

1+ parts

$7.854

100+ parts

-

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-

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3,120

$7.854

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Vyrian

USA . 5,277 parts In-Stock

1+ parts

-

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5,277

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,345 parts In-Stock

1+ parts

$7.440

100+ parts

-

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-

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1,345

$7.440

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AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$16.990

100+ parts

-

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764

$16.990

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Parana Technologies

USA . 65 parts In-Stock

1+ parts

$53.439

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-

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65

$53.439

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DigiPath Technology Company

USA . 1,966 parts In-Stock

1+ parts

$58.843

100+ parts

$54.136

1k+ parts

-

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1,966

$58.843

$54.136

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ChromeModa Solutions

Germany . 2,130 parts In-Stock

1+ parts

$60.044

100+ parts

$49.236

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-

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2,130

$60.044

$49.236

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IDEA Electronic Components Group

UK . 1,333 parts In-Stock

1+ parts

$60.044

100+ parts

$57.042

1k+ parts

$54.040

10k+ parts

-

1,333

$60.044

$57.042

$54.040

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Lixinc

USA . 14,495 parts In-Stock

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-

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14,495

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Perfect Parts

USA . 13,440 parts In-Stock

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13,440

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Overview

Unlock the potential of your projects with the TMS320F28034PAGQR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers reliable and high-quality products that meet the demands of various applications. This microcontroller offers cutting-edge features and benefits, including advanced peripherals like PWM and ADC channels, along with connectivity options such as CAN and SPI. With a wide temperature range and automotive-grade quality, this microcontroller is ideal for automotive, industrial, and consumer electronics applications. Trust Texas Instruments to provide you with the tools you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring reliable performance in various environments.

ADC Channels: YES

Allows for analog to digital conversion, making it suitable for applications that require sensor interfacing and data acquisition.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, providing the necessary features and capabilities for embedded systems and control applications.

Connectivity: CAN, I2C, LIN, SCI, SPI

Offers versatile connectivity options for communication with other devices or systems, enabling integration into a wide range of networks.

ROM Programmability: FLASH

Allows for reprogramming of the ROM, providing flexibility for firmware updates and customization without the need for external programming tools.

Technical Specifications

Microcontrollers TMS320F28034PAGQR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

C28X

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

33

No. of Terminals:

64

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

20480

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, LIN, SCI, SPI

Peripherals:

BOR, COMPARATOR(3), POR, PWM(18), TIMER(3), WDT

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

TMS320F28034PAGQR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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