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TMS320F28033PAGS

Texas Instruments

TMS320F28033PAGS by Texas Instruments

TMS320F28033PAGS by Texas Instruments is a 32-bit microcontroller with 3 external interrupts, 14-Ch 12-Bit ADC channels, and 21 PWM channels. Ideal for automotive applications due to AEC-Q100 screening level and connectivity options like CAN, I2C, LIN, SCI, SPI. Operates at max frequency of 60 MHz with low power mode support.

Median Price

$6.801

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 36,676 parts In-Stock

1+ parts

$6.801

100+ parts

$5.544

1k+ parts

$3.696

10k+ parts

-

36,676

$6.801

$5.544

$3.696

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,417 parts In-Stock

1+ parts

$6.461

100+ parts

-

1k+ parts

-

10k+ parts

-

3,417

$6.461

-

-

-

Vyrian

USA . 4,059 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,059

-

-

-

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Rebound Electronics

UK . 1,500 parts In-Stock

1+ parts

-

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-

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1,500

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HZD GmbH

Germany . 450 parts In-Stock

1+ parts

-

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-

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,739 parts In-Stock

1+ parts

$6.121

100+ parts

-

1k+ parts

-

10k+ parts

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1,739

$6.121

-

-

-

Microchip USA

USA . 1,612 parts In-Stock

1+ parts

$18.610

100+ parts

$18.340

1k+ parts

$18.210

10k+ parts

$18.070

1,612

$18.610

$18.340

$18.210

$18.070

Parana Technologies

USA . 927 parts In-Stock

1+ parts

$45.677

100+ parts

-

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927

$45.677

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-

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DigiPath Technology Company

USA . 200 parts In-Stock

1+ parts

$50.296

100+ parts

$46.272

1k+ parts

-

10k+ parts

-

200

$50.296

$46.272

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-

ChromeModa Solutions

Germany . 2,395 parts In-Stock

1+ parts

$51.322

100+ parts

$42.084

1k+ parts

-

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2,395

$51.322

$42.084

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IDEA Electronic Components Group

UK . 550 parts In-Stock

1+ parts

$51.322

100+ parts

$48.756

1k+ parts

$46.190

10k+ parts

-

550

$51.322

$48.756

$46.190

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A-Z Elektronik GmbH

Germany . 5,606 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,606

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Overview

Unleash the power of innovation with the TMS320F28033PAGS by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are perfect for a wide range of applications. With a focus on value and performance, this product offers customers unparalleled benefits like advanced connectivity options, low power mode, and high-speed operation. Whether you're working on automotive projects or industrial applications, the TMS320F28033PAGS is sure to exceed your expectations. Elevate your designs with Texas Instruments and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 1.995 V

Allows for a wide range of supply voltage compatibility, increasing flexibility in power source selection.

ADC Channels: YES

Integrated Analog to Digital Converters allow for accurate and efficient conversion of analog signals to digital data.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance and functionality.

Connectivity: "CAN, I2C, LIN, SCI, SPI

Supports a range of communication protocols, enabling connectivity with various devices and systems.

Speed: 60 rpm

High clock frequency allows for fast processing and response times, ideal for real-time applications.

Low Power Mode: YES

Efficient power management capability helps in reducing power consumption and extending battery life.

Technical Specifications

Microcontrollers TMS320F28033PAGS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

20

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, I2C, LIN, SCI, SPI"

Peripherals:

"BOR, COMPARATOR(3), PWM(21), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

TMS320F28033PAGS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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