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TMS320F28031PAGT

Texas Instruments

TMS320F28031PAGT by Texas Instruments

TMS320F28031PAGT by Texas Instruments is a 32-bit microcontroller with 16-bit RAM, 32768 ROM words, and 14-Ch 12-Bit ADC channels. Ideal for industrial applications, it offers CAN, I2C, LIN connectivity and operates at a max frequency of 60 MHz. With low power mode and multiple PWM channels, it's suitable for various control systems.

Median Price

$7.083

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 874 parts In-Stock

1+ parts

$5.796

100+ parts

$4.725

1k+ parts

$3.150

10k+ parts

-

874

$5.796

$4.725

$3.150

-

DigiKey

USA . 20 parts In-Stock

1+ parts

$8.370

100+ parts

$6.020

1k+ parts

$5.063

10k+ parts

$4.969

20

$8.370

$6.020

$5.063

$4.969

Mouser Electronics

USA . 49 parts In-Stock

1+ parts

$9.500

100+ parts

$6.150

1k+ parts

$5.690

10k+ parts

-

49

$9.500

$6.150

$5.690

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Chip1Stop

Japan . 13,920 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.678

10k+ parts

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13,920

-

-

$3.678

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Distributors (In-Stock)

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Digiode

USA . 4,906 parts In-Stock

1+ parts

$5.506

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-

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4,906

$5.506

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Vyrian

USA . 6,202 parts In-Stock

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-

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6,202

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PC Components Company LLC

USA . 1,280 parts In-Stock

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1,280

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Bristol Electronics

USA . 1,280 parts In-Stock

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1,280

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HZD GmbH

Germany . 713 parts In-Stock

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713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 963 parts In-Stock

1+ parts

$5.216

100+ parts

-

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963

$5.216

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-

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Parana Technologies

USA . 1,685 parts In-Stock

1+ parts

$32.656

100+ parts

-

1k+ parts

$110.892

10k+ parts

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1,685

$32.656

-

$110.892

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DigiPath Technology Company

USA . 1,615 parts In-Stock

1+ parts

$35.958

100+ parts

$33.082

1k+ parts

-

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1,615

$35.958

$33.082

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ChromeModa Solutions

Germany . 1,937 parts In-Stock

1+ parts

$36.692

100+ parts

$30.087

1k+ parts

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1,937

$36.692

$30.087

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IDEA Electronic Components Group

UK . 1,580 parts In-Stock

1+ parts

$36.692

100+ parts

$34.857

1k+ parts

$33.023

10k+ parts

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1,580

$36.692

$34.857

$33.023

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Lixinc

USA . 10,167 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,872 parts In-Stock

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4,872

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 150 parts In-Stock

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150

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iodParts Technologies Inc.

India . 148 parts In-Stock

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148

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Overview

Unleash the power of innovation with the TMS320F28031PAGT by Texas Instruments. This cutting-edge microcontroller offers unmatched quality and reliability, making it the ideal choice for a wide range of applications. With advanced features like 14-channel ADCs, 21 PWM channels, and connectivity options including CAN, I2C, LIN, SCI, and SPI, this microcontroller provides unparalleled value and performance. Experience seamless operation and enhanced functionality with the TMS320F28031PAGT, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability to the microcontroller, making it suitable for a variety of environments.

Maximum Supply Voltage: 1.995 V

Allows for flexibility in power supply options, catering to different voltage requirements.

ROM Words: 32768

Ample amount of ROM words for storing program data, enhancing the functionality and capabilities of the microcontroller.

Max. Clock Frequency: 60 MHz

High clock frequency allows for faster processing speeds, making the microcontroller efficient for tasks requiring quick response times.

Analog To Digital Convertors: 14-Ch 12-Bit

Multiple ADC channels with high resolution provide accurate analog to digital conversion, essential for sensor interfacing and data acquisition.

Technical Specifications

Microcontrollers TMS320F28031PAGT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of I/O Lines:

33

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

120 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN, I2C, LIN, SCI, SPI"

Peripherals:

"BOR, COMPARATOR(3), PWM(21), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

TMS320F28031PAGT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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