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TMS320F28023DAQ

Texas Instruments

TMS320F28023DAQ by Texas Instruments

TMS320F28023DAQ by Texas Instruments is a 32-bit microcontroller with 7-Ch 12-Bit ADC, 3 timers, and PWM(12) peripherals. Ideal for automotive applications with operating temperature range of -40 to 125 °C and connectivity options like I2C, SCI, SPI, UART. It features low power mode and flash ROM programmability for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,590 parts In-Stock

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3,590

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Vyrian

USA . 3,079 parts In-Stock

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3,079

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Distributors (Availability)

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AZTECH Wire

Italy . 628 parts In-Stock

1+ parts

$13.307

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628

$13.307

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Microchip USA

USA . 1,218 parts In-Stock

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$16.950

100+ parts

$16.700

1k+ parts

$16.580

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$16.460

1,218

$16.950

$16.700

$16.580

$16.460

One Stop Electronics

USA . 1,304 parts In-Stock

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$31.000

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1,304

$31.000

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Parana Technologies

USA . 2,145 parts In-Stock

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$42.838

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$42.838

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DigiPath Technology Company

USA . 1,545 parts In-Stock

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$47.170

100+ parts

$43.397

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1,545

$47.170

$43.397

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ChromeModa Solutions

Germany . 4,781 parts In-Stock

1+ parts

$48.133

100+ parts

$39.469

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4,781

$48.133

$39.469

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IDEA Electronic Components Group

UK . 2,303 parts In-Stock

1+ parts

$48.133

100+ parts

$45.726

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$43.320

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2,303

$48.133

$45.726

$43.320

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Corphita

USA . 3,711 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320F28023DAQ microcontroller by Texas Instruments. Designed with precision and expertise, this device offers unmatched performance and reliability for a wide range of applications in the automotive industry and beyond. Experience seamless connectivity, high-speed processing, and low power consumption, all in a compact package that delivers exceptional value for customers. Trust in Texas Instruments to provide you with the tools you need to bring your innovations to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliable performance.

Maximum Supply Voltage: 1.995 V

Allows for a wide range of supply voltage inputs, making the microcontroller versatile in different applications.

Bit Size: 32

Offers high processing capability and performance for handling complex tasks efficiently.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, suitable for automotive and industrial applications.

ADC Channels: YES

Enables analog to digital conversion, providing accurate and precise data acquisition capabilities.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance and functionality.

Connectivity: I2C, SCI, SPI, UART

Supports various communication protocols, allowing seamless integration with other devices and systems.

PWM Channels: YES

Includes Pulse Width Modulation channels for controlling motor speeds and other applications requiring precise pulse control.

Technical Specifications

Microcontrollers TMS320F28023DAQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

12

ROM Words:

32768

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SCI, SPI, UART"

Peripherals:

"BOR, COMPARATOR, POR, PWM(12), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

TMS320F28023DAQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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