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TMS320F280220DAS

Texas Instruments

TMS320F280220DAS by Texas Instruments

TMS320F280220DAS by Texas Instruments is a 32-bit microcontroller with 3.63V max supply voltage, 30MHz clock frequency, and 14-Ch 12-Bit ADC channels. Ideal for automotive applications due to its -40 to 125°C operating temperature range, it offers low power mode and peripherals like PWM, RTC, and timers.

Median Price

$5.315

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,265 parts In-Stock

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4,265

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Vyrian

USA . 4,240 parts In-Stock

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TME

Poland . 200 parts In-Stock

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$5.315

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200

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$5.315

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Distributors (Availability)

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AZTECH Wire

Italy . 844 parts In-Stock

1+ parts

$13.832

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844

$13.832

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Microchip USA

USA . 187 parts In-Stock

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$29.120

100+ parts

$29.030

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$29.030

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$28.940

187

$29.120

$29.030

$29.030

$28.940

One Stop Electronics

USA . 1,323 parts In-Stock

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$33.000

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1,323

$33.000

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Parana Technologies

USA . 296 parts In-Stock

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$71.491

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296

$71.491

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ChromeModa Solutions

Germany . 3,187 parts In-Stock

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$80.327

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$65.868

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3,187

$80.327

$65.868

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IDEA Electronic Components Group

UK . 1,368 parts In-Stock

1+ parts

$80.327

100+ parts

$76.311

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$72.294

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1,368

$80.327

$76.311

$72.294

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Component Stockers USA

USA . 772 parts In-Stock

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$99.990

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772

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Corphita

USA . 4,381 parts In-Stock

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DigiPath Technology Company

USA . 2,254 parts In-Stock

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$72.423

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320F280220DAS microcontroller by Texas Instruments. Designed with precision and expertise, this device offers unparalleled quality and reliability in a compact package. Ideal for a wide range of applications, from automotive to industrial automation, this microcontroller boasts advanced features such as ADC channels, PWM, RTC, and more. Experience seamless connectivity with I2C, SCI, and SPI interfaces, while maximizing efficiency with low power modes. Elevate your projects with the TMS320F280220DAS and revolutionize the way you innovate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the microcontroller lightweight and durable.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 3.63 V

Support for a maximum supply voltage of 3.63V gives flexibility in power options for the device.

On Chip Data RAM Width: 16

Having a data RAM width of 16 allows for efficient data processing and storage capabilities.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly.

Bit Size: 32

32-bit architecture provides higher performance and processing capabilities compared to lower bit sizes.

Power Supplies (V): 1.8,3.3

Support for multiple power supply options of 1.8V and 3.3V increases compatibility with various systems.

No. of Terminals: 38

Having 38 terminals allows for a good number of input/output options for connectivity and expansion.

Technical Specifications

Microcontrollers TMS320F280220DAS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

3

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SCI, SPI"

Peripherals:

"BOR, PWM, RTC, TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

14-Ch 12-Bit

Trade Compliance

TMS320F280220DAS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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