Loading...

TMS320F280200DAT

Texas Instruments

TMS320F280200DAT by Texas Instruments

TMS320F280200DAT by Texas Instruments is a 32-bit microcontroller with 3 timers, 7-Ch 12-Bit ADC, and 12 PWM channels. Ideal for industrial applications requiring low power mode, it operates at up to 30 MHz with a temperature range of -40 to 105°C.

Median Price

$2.898

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,865 parts In-Stock

1+ parts

$3.246

100+ parts

$2.646

1k+ parts

$1.764

10k+ parts

-

3,865

$3.246

$2.646

$1.764

-

DigiKey

USA . 88 parts In-Stock

1+ parts

$4.960

100+ parts

$3.358

1k+ parts

$2.832

10k+ parts

$2.751

88

$4.960

$3.358

$2.832

$2.751

Avnet

USA . 58 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.228

10k+ parts

$2.173

58

-

-

$2.228

$2.173

Rochester

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$2.550

1k+ parts

$2.280

10k+ parts

$2.140

28

-

$2.550

$2.280

$2.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,377 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

-

10k+ parts

-

2,377

$2.328

-

-

-

Chip Stock

USA . 4,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,570

-

-

-

-

Vyrian

USA . 3,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,214

-

-

-

-

Bristol Electronics

USA . 593 parts In-Stock

1+ parts

-

100+ parts

$1.764

1k+ parts

$1.549

10k+ parts

-

593

-

$1.764

$1.549

-

ACDS - Activité Composants Distribution Service

France . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Dan-Mar Components

USA . 80 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

80

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 617 parts In-Stock

1+ parts

$2.205

100+ parts

-

1k+ parts

-

10k+ parts

-

617

$2.205

-

-

-

Microchip USA

USA . 2,991 parts In-Stock

1+ parts

$30.680

100+ parts

$30.490

1k+ parts

$30.400

10k+ parts

$30.300

2,991

$30.680

$30.490

$30.400

$30.300

Parana Technologies

USA . 124 parts In-Stock

1+ parts

$34.798

100+ parts

-

1k+ parts

-

10k+ parts

-

124

$34.798

-

-

-

ChromeModa Solutions

Germany . 3,491 parts In-Stock

1+ parts

$39.099

100+ parts

$32.061

1k+ parts

-

10k+ parts

-

3,491

$39.099

$32.061

-

-

IDEA Electronic Components Group

UK . 1,418 parts In-Stock

1+ parts

$39.099

100+ parts

$37.144

1k+ parts

$35.189

10k+ parts

-

1,418

$39.099

$37.144

$35.189

-

Lixinc

USA . 16,534 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,534

-

-

-

-

Authorized Procurement Solutions

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

DigiPath Technology Company

USA . 1,920 parts In-Stock

1+ parts

-

100+ parts

$35.252

1k+ parts

-

10k+ parts

-

1,920

-

$35.252

-

-

Kepictronics

USA . 565 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

565

-

-

-

-

Perfect Parts

USA . 463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

463

-

-

-

-

Overview

Unlock unparalleled performance and reliability with the TMS320F280200DAT microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality in every product they create. This powerful microcontroller offers a wide range of applications in various industries, providing customers with exceptional value and benefits. Experience seamless connectivity, low power consumption, and high-speed processing with this cutting-edge technology. Upgrade your projects with the TMS320F280200DAT and stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection and durability for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 1.995 V

Can operate effectively with a relatively low maximum supply voltage, providing energy efficiency.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for efficient data processing and storage capabilities.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape provides versatility in mounting options and space-saving benefits in compact electronic devices.

Bit Size: 32

32-bit architecture offers high computational power and performance for demanding applications.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options for flexibility in different voltage requirements.

No. of Terminals: 38

Sufficient number of terminals for easy interfacing with external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and allows for efficient heat dissipation.

Minimum Supply Voltage: 1.71 V

Can operate at low supply voltages, enhancing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures reliable performance in varying environmental conditions.

CPU Family: TMS320

Part of the TMS320 family known for its high performance and versatile features for diverse applications.

No. of External Interrupts: 3

Multiple external interrupts allow for efficient multitasking and real-time event handling.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, making it suitable for a wide range of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish for reliable connections and durability over extended use.

ADC Channels: YES

Integrated Analog to Digital Converters (ADC) provide signal conversion capabilities for sensor data acquisition.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and PCB layout flexibility.

ROM Words: 8192

Large ROM capacity for storing program instructions and data, enhancing the versatility of the microcontroller.

Maximum Seated Height: 1.2 mm

Low profile design with minimal seated height for compact and space-constrained applications.

RAM Words: 6

Efficient RAM word configuration for storing and accessing data during program execution.

Width: 6.1 mm

Narrow width design for space-saving benefits and easy integration into small form factor devices.

Boundary Scan: YES

Boundary scan feature for easy debugging, testing, and programming, enhancing the development process.

Peripherals: "BOR, COMPARATOR, POR, PWM(12), TEMPERATURE SENSOR, TIMER(3), WDT

Wide range of integrated peripherals for versatile functionality and adaptability in various applications.

Maximum Clock Frequency: 30 MHz

High clock frequency capability for fast data processing and real-time operation.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust assembly processes and reliability.

Length: 12.5 mm

Compact length design for space-efficient integration in electronic devices and PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable performance in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Specifically designed as a microcontroller for efficient control and processing tasks in embedded systems.

No. of Timers: 3

Multiple timer units for time-sensitive operations, scheduling, and event management.

RAM Bytes: 12288

Generous RAM capacity for temporary data storage and efficient program execution.

Technology: CMOS

CMOS technology for low power consumption, high noise immunity, and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form for secure soldering and reliable electrical connections.

Analog To Digital Convertors: 7-Ch 12-Bit

Multiple 12-bit ADC channels for accurate analog signal conversion and data acquisition.

Maximum Supply Current: 70 mA

Low maximum supply current for energy-efficient operation and minimal power consumption.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent performance and reliable operation.

PWM Channels: YES

Integrated Pulse Width Modulation (PWM) channels for precise control of digital outputs and motor control.

Connectivity: "I2C, SCI, SPI, UART

Support for multiple communication interfaces for seamless connectivity with external devices and systems.

ROM Programmability: FLASH

Flash programmable ROM for flexibility in programming, debugging, and updating firmware.

Terminal Pitch: 0.65 mm

Fine terminal pitch for high-density PCB layout and compact design integration.

Format: FIXED POINT

Fixed-point arithmetic format for efficient mathematical calculations and data processing.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating for resistance to moisture-induced damage during storage and assembly processes.

Speed: 40 rpm

High speed operation for real-time processing and time-critical applications.

Low Power Mode: YES

Low power mode option for energy-saving operation and extended battery life.

On Chip Program ROM Width: 8

On-chip ROM width of 8 for efficient program storage and execution.

No. of I/O Lines: 20

Sufficient number of I/O lines for interfacing with external devices and peripherals, enabling versatile connectivity.

Technical Specifications

Microcontrollers TMS320F280200DAT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

30 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

12288

RAM Words:

6

ROM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SCI, SPI, UART"

Peripherals:

"BOR, COMPARATOR, POR, PWM(12), TEMPERATURE SENSOR, TIMER(3), WDT"

Analog To Digital Convertors:

7-Ch 12-Bit

Trade Compliance

TMS320F280200DAT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20