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TMS320C28345ZHHT

Texas Instruments

TMS320C28345ZHHT by Texas Instruments

TMS320C28345ZHHT by Texas Instruments is a 32-bit microcontroller with 300 MHz clock frequency, 528KB RAM, and 18 timers. It is used in industrial applications requiring CAN, I2C, SCI, and SPI connectivity along with low power mode support.

Median Price

$16.096

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 1,280 parts In-Stock

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$16.096

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$15.699

1,280

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$16.096

$15.699

Distributors (In-Stock)

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Vyrian

USA . 8,812 parts In-Stock

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Digiode

USA . 2,852 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,273 parts In-Stock

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$13.680

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AZTECH Wire

Italy . 228 parts In-Stock

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$20.020

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Parana Technologies

USA . 1,238 parts In-Stock

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$51.404

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DigiPath Technology Company

USA . 1,591 parts In-Stock

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$56.602

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$52.074

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1,591

$56.602

$52.074

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ChromeModa Solutions

Germany . 5,952 parts In-Stock

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$57.757

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$47.361

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IDEA Electronic Components Group

UK . 45 parts In-Stock

1+ parts

$57.757

100+ parts

$54.869

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$51.981

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45

$57.757

$54.869

$51.981

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Corphita

USA . 538 parts In-Stock

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Microchip USA

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Kepictronics

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Perfect Parts

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Overview

Elevate your projects to new heights with the TMS320C28345ZHHT microcontroller by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments delivers cutting-edge technology in a compact package. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and versatility. Unlock endless possibilities with advanced features like DMA channels, PWM functions, and extensive connectivity options. Experience seamless operation and superior functionality with the TMS320C28345ZHHT microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and extending the battery life of the device.

Bit Size: 32

The 32-bit architecture allows for higher processing power and performance compared to lower bit sizes.

Power Supplies (V): 1.1, 1.8, 3.3

The availability of multiple power supplies allows for flexibility in power management and compatibility with various systems.

ADC Channels: YES

The presence of Analog-to-Digital Converter (ADC) channels enables the microcontroller to interface with analog sensors and devices.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and processing capabilities into a single chip, reducing the need for external components.

Connectivity: "CAN(2), I2C, SCI(3), SPI(4)

The multiple connectivity options including CAN, I2C, SCI, and SPI interfaces allow for versatile communication with external devices and systems.

Speed: 300 rpm

The high clock frequency of 300 MHz enables fast processing and data handling, making the product suitable for real-time applications.

Technical Specifications

Microcontrollers TMS320C28345ZHHT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

16

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

88

No. of Serial I/Os:

2

No. of Terminals:

179

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

528384

RAM Words:

516

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C, SCI(3), SPI(4)"

Peripherals:

"DMA(6), PWM(18), TIMER(18), WDT"

Trade Compliance

TMS320C28345ZHHT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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