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TMS320C28343ZFEQ

Texas Instruments

TMS320C28343ZFEQ by Texas Instruments

TMS320C28343ZFEQ by Texas Instruments is a 32-bit microcontroller with 22-bit address bus, 16-bit on-chip data RAM, and max clock frequency of 300 MHz. Ideal for automotive applications due to its low power mode, connectivity options like CAN, I2C, SCI, SPI, and peripherals including DMA, PWM, TIMER.

Median Price

$28.807

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,280 parts In-Stock

1+ parts

$28.807

100+ parts

$25.606

1k+ parts

$18.828

10k+ parts

-

1,280

$28.807

$25.606

$18.828

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,832 parts In-Stock

1+ parts

$27.367

100+ parts

-

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4,832

$27.367

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Vyrian

USA . 2,936 parts In-Stock

1+ parts

-

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2,936

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Chip Stock

USA . 2,780 parts In-Stock

1+ parts

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2,780

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,200 parts In-Stock

1+ parts

$19.380

100+ parts

-

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1,200

$19.380

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Ampacity Inc.

Singapore . 890 parts In-Stock

1+ parts

$24.490

100+ parts

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890

$24.490

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Corphita

USA . 2,207 parts In-Stock

1+ parts

$25.926

100+ parts

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2,207

$25.926

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Parana Technologies

USA . 1,745 parts In-Stock

1+ parts

$59.887

100+ parts

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1,745

$59.887

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Microchip USA

USA . 1,170 parts In-Stock

1+ parts

$66.480

100+ parts

$65.320

1k+ parts

$64.750

10k+ parts

$64.170

1,170

$66.480

$65.320

$64.750

$64.170

ChromeModa Solutions

Germany . 3,281 parts In-Stock

1+ parts

$67.289

100+ parts

$55.177

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3,281

$67.289

$55.177

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IDEA Electronic Components Group

UK . 1,109 parts In-Stock

1+ parts

$67.289

100+ parts

$63.925

1k+ parts

$60.560

10k+ parts

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1,109

$67.289

$63.925

$60.560

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DigiPath Technology Company

USA . 1,518 parts In-Stock

1+ parts

-

100+ parts

$60.668

1k+ parts

-

10k+ parts

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1,518

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$60.668

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Overview

Discover the ultimate solution for your microcontroller needs with the TMS320C28343ZFEQ by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments offers a wide range of applications for their microcontrollers, making them versatile and efficient for your projects. With advanced features like DAC channels, ADC channels, PWM channels, and more, this product provides unparalleled value and benefits to customers looking for cutting-edge technology. Upgrade your systems today with the TMS320C28343ZFEQ and experience the advantages of Texas Instruments innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for packaging microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for easier and more efficient manufacturing and assembly processes.

Maximum Supply Voltage: 1.26 V

Operates within a low voltage range, making it suitable for low power applications.

Address Bus Width: 22

Wide address bus allows for a larger memory address space, enabling greater flexibility in programming and data storage.

Bit Size: 32

A 32-bit architecture provides high performance and processing capabilities for complex applications.

ADC Channels: YES

Built-in Analog-to-Digital Converters allow for accurate and reliable analog input conversions.

DAC Channels: YES

Integrated Digital-to-Analog Converters enable the microcontroller to output analog signals as needed.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology offers low power consumption and high noise immunity.

Connectivity: "CAN(2), I2C, SCI(3), SPI(4)

Supports multiple communication protocols, enhancing connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers TMS320C28343ZFEQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT ALSO OPERATES AT 3.3V

Address Bus Width:

22

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

300 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

8

No. of I/O Lines:

88

No. of Serial I/Os:

2

No. of Terminals:

256

No. of Timers:

18

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

266240

RAM Words:

260

ROM Words:

8192

ROM Programmability:

MROM

Maximum Seated Height:

2.1 mm

Speed:

300 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C, SCI(3), SPI(4)"

Peripherals:

"DMA(6), PWM(18), TIMER(18), WDT"

Trade Compliance

TMS320C28343ZFEQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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