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TMS2791NL

Texas Instruments

TMS2791NL by Texas Instruments

TMS2791NL by Texas Instruments is a MOS technology secondary storage controller with 40 terminals in an inline rectangular package. It operates b/w 0°C to 70°C, suitable for commercial applications requiring through-hole terminal form and 2.54mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,125 parts In-Stock

1+ parts

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6,125

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Digiode

USA . 3,880 parts In-Stock

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3,880

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 208 parts In-Stock

1+ parts

$9.000

100+ parts

-

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208

$9.000

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AZTECH Wire

Italy . 370 parts In-Stock

1+ parts

$17.321

100+ parts

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370

$17.321

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Corohmni

South Africa . 5,216 parts In-Stock

1+ parts

$31.925

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5,216

$31.925

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Parana Technologies

USA . 1,865 parts In-Stock

1+ parts

$62.940

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1,865

$62.940

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DigiPath Technology Company

USA . 1,693 parts In-Stock

1+ parts

$69.305

100+ parts

$63.760

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1,693

$69.305

$63.760

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ChromeModa Solutions

Germany . 6,761 parts In-Stock

1+ parts

$70.719

100+ parts

$57.990

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6,761

$70.719

$57.990

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IDEA Electronic Components Group

UK . 2,028 parts In-Stock

1+ parts

$70.719

100+ parts

$67.183

1k+ parts

$63.647

10k+ parts

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2,028

$70.719

$67.183

$63.647

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Corphita

USA . 3,278 parts In-Stock

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3,278

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Overview

Elevate your secondary storage controller game with the TMS2791NL from Texas Instruments. Crafted with precision and expertise, this rectangular package boasts 40 terminals and a temperature range of 0 to 70°C. Perfect for a wide range of applications, this MOS technology device offers top-notch performance and reliability. Upgrade your systems today with the TMS2791NL and experience unparalleled value and efficiency in your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and lightweight construction, making the product easy to handle and resistant to physical damage.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices or systems, ensuring a compact and space-efficient design.

No. of Terminals: 40

Having 40 terminals provides ample connection points for various external devices or components, increasing the versatility and functionality of the product.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can reliably function within a wide range of environmental conditions, ensuring optimal performance in diverse settings.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures the product's reliability and functionality even in low-temperature environments.

Terminal Position: DUAL

Dual terminal positions offer flexibility in connecting additional devices or systems, allowing for enhanced compatibility and customization options.

Technology: MOS

Utilizing MOS technology ensures efficient and reliable performance in processing and transmitting data, making the product suitable for high-speed data transfers and storage operations.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm provides standard spacing for easy soldering and connection of external components, simplifying the installation process and ensuring secure connections.

Technical Specifications

Secondary Storage Controllers TMS2791NL attributes and parameters. Explore more Secondary Storage Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T40

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Secondary Storage Controllers

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS2791NL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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