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TMS1121NLL

Texas Instruments

TMS1121NLL by Texas Instruments

TMS1121NLL by Texas Instruments is a Clock IC with 28 terminals in an IN-LINE package. It utilizes MOS technology with 2.54mm terminal pitch. Ideal for applications requiring precise timing control in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,034 parts In-Stock

1+ parts

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4,034

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Vyrian

USA . 2,181 parts In-Stock

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2,181

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Corel Iberica Componentes, S.L.

Spain . 4 parts In-Stock

1+ parts

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,414 parts In-Stock

1+ parts

$1.061

100+ parts

-

1k+ parts

$1.917

10k+ parts

-

1,414

$1.061

-

$1.917

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ChromeModa Solutions

Germany . 551 parts In-Stock

1+ parts

$1.192

100+ parts

$0.977

1k+ parts

-

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551

$1.192

$0.977

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IDEA Electronic Components Group

UK . 26 parts In-Stock

1+ parts

$1.192

100+ parts

-

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$1.073

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26

$1.192

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$1.073

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AZTECH Wire

Italy . 635 parts In-Stock

1+ parts

$7.608

100+ parts

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635

$7.608

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One Stop Electronics

USA . 534 parts In-Stock

1+ parts

$13.800

100+ parts

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534

$13.800

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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Corphita

USA . 4,611 parts In-Stock

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4,611

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DigiPath Technology Company

USA . 1,065 parts In-Stock

1+ parts

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$1.075

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1,065

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$1.075

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Assy Fe

Spain . 4 parts In-Stock

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4

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Overview

Enhance your electronic designs with the TMS1121NLL by Texas Instruments, a leading manufacturer known for its high-quality clock ICs. Perfect for a wide range of applications, this rectangular-shaped package boasts 28 terminals in an in-line style, making it versatile and easy to integrate into your projects. With dual terminal positions and advanced MOS technology, this product offers unmatched reliability and precision. Elevate your creations with the TMS1121NLL and experience the superior performance and value that Texas Instruments is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the clock ICs easy to handle and less likely to break during installation or handling.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on a circuit board, maximizing the number of components that can be placed in a limited area.

No. of Terminals: 28

With 28 terminals, this clock IC has a good number of connection points, making it versatile and suitable for a variety of applications.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to insert the clock IC into a circuit board, simplifying the installation process.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in connecting the clock IC to other components, making it easier to integrate into different circuit designs.

Technology: MOS

MOS technology offers high speed and low power consumption, making the clock IC energy-efficient and suitable for applications where power efficiency is important.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong and reliable connection to the circuit board, reducing the risk of signal interference or loss.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the clock IC allows for easy and precise soldering, ensuring secure connections and reliable performance.

Technical Specifications

Clock ICs TMS1121NLL attributes and parameters. Explore more Clock ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Clock ICs

Surface Mount:

NO

Technology:

MOS

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS1121NLL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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