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TMS1121CNLL

Texas Instruments

TMS1121CNLL by Texas Instruments

TMS1121CNLL by Texas Instruments is a Clock IC with 28 terminals in PLASTIC/EPOXY package. Operating temperature range: 0-70°C, suitable for commercial applications. Features MOS technology and through-hole terminal form with 2.54mm pitch, ideal for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,312 parts In-Stock

1+ parts

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5,312

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Digiode

USA . 338 parts In-Stock

1+ parts

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338

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 961 parts In-Stock

1+ parts

$3.024

100+ parts

-

1k+ parts

$3.533

10k+ parts

-

961

$3.024

-

$3.533

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DigiPath Technology Company

USA . 1,594 parts In-Stock

1+ parts

$3.330

100+ parts

$3.064

1k+ parts

-

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1,594

$3.330

$3.064

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ChromeModa Solutions

Germany . 5,067 parts In-Stock

1+ parts

$3.398

100+ parts

$2.786

1k+ parts

-

10k+ parts

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5,067

$3.398

$2.786

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IDEA Electronic Components Group

UK . 862 parts In-Stock

1+ parts

$3.398

100+ parts

-

1k+ parts

$3.058

10k+ parts

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862

$3.398

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$3.058

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One Stop Electronics

USA . 338 parts In-Stock

1+ parts

$4.800

100+ parts

-

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10k+ parts

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338

$4.800

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AZTECH Wire

Italy . 555 parts In-Stock

1+ parts

$15.110

100+ parts

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555

$15.110

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Corphita

USA . 3,619 parts In-Stock

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3,619

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Overview

Enhance your electronic designs with the TMS1121CNLL Clock IC by Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in clock ICs. Ideal for a wide range of applications, this Clock IC offers precise timing solutions with ease of integration. Boost your product performance and efficiency with the TMS1121CNLL, providing value, benefits, and advantages that cater to your specific needs. Elevate your projects to the next level with Texas Instruments Clock ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the clock ICs lightweight and durable, making them easier to handle and less prone to damage during handling and installation.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration with other components on a circuit board, maximizing space efficiency and enabling compact designs.

No. of Terminals: 28

With a higher number of terminals, the clock ICs can support more complex functionalities and connections, enabling versatile applications in various electronic devices.

Package Style (Meter): IN-LINE

The in-line package style makes it convenient for the clock ICs to be mounted and connected in a linear configuration, simplifying the design and assembly process.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in industrial or harsh environments where temperatures can fluctuate, making the clock ICs suitable for a wide range of applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the clock ICs to work efficiently in cold environments without compromising their functionality, providing consistent performance across different temperature conditions.

Terminal Position: DUAL

The dual terminal position allows for improved connectivity and signal transmission, enhancing the overall efficiency and reliability of the clock ICs in electronic devices.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades signifies that the clock ICs are suitable for standard commercial applications, offering a cost-effective solution with reliable performance for everyday use.

Technology: MOS

The MOS technology used in the clock ICs ensures low power consumption, high-speed operation, and integrated circuit miniaturization, making them energy-efficient and ideal for portable or battery-operated devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies the soldering process and provides secure connections to the circuit board, ensuring stable performance and longevity of the clock ICs in electronic systems.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connectivity and compatibility with standard PCB layouts, facilitating the integration of the clock ICs into various electronic designs with standardized spacing requirements.

Technical Specifications

Clock ICs TMS1121CNLL attributes and parameters. Explore more Clock ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Clock ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS1121CNLL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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