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TMP423AIDCNTG4

Texas Instruments

TMP423AIDCNTG4 by Texas Instruments

TMP423AIDCNTG4 by Texas Instruments is a 12-bit temperature sensor with 2.5 °C accuracy, operating from -40 to 125 °C. It features a 2-wire interface, digital output, and serial communication in a compact rectangular package. Ideal for applications requiring precise temperature monitoring in various environments.

Median Price

$1.165

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 500 parts In-Stock

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$1.165

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500

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$1.165

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Distributors (In-Stock)

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Vyrian

USA . 8,770 parts In-Stock

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8,770

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Digiode

USA . 116 parts In-Stock

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116

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Distributors (Availability)

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Semicontronic

India . 18 parts In-Stock

1+ parts

$0.990

100+ parts

$0.965

1k+ parts

$0.960

10k+ parts

-

18

$0.990

$0.965

$0.960

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Ampacity Inc.

Singapore . 388 parts In-Stock

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$1.000

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388

$1.000

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Corohmni

South Africa . 379 parts In-Stock

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$1.181

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379

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Parana Technologies

USA . 1,639 parts In-Stock

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$1.839

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$2.387

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1,639

$1.839

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$2.387

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DigiPath Technology Company

USA . 2,200 parts In-Stock

1+ parts

$2.025

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$1.863

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$2.025

$1.863

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ChromeModa Solutions

Germany . 6,106 parts In-Stock

1+ parts

$2.066

100+ parts

$1.694

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6,106

$2.066

$1.694

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IDEA Electronic Components Group

UK . 711 parts In-Stock

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$2.066

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$1.859

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711

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$1.859

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Corphita

USA . 1,738 parts In-Stock

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Overview

Elevate your temperature sensing capabilities with the TMP423AIDCNTG4 by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-notch quality and reliability. The TMP423AIDCNTG4 belongs to the temperature sensors category, offering precise readings and versatile applications. With its compact size and efficient power consumption, this sensor provides unmatched value and performance for your projects. Trust Texas Instruments for innovative solutions that elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the sensor suitable for various applications.

Maximum Supply Voltage: 5.5 V

Wide range of supply voltage allows flexibility in powering the sensor, accommodating different system requirements.

No. of Bits: 12

Higher number of bits provides more accurate temperature readings, making this sensor reliable for precise measurements.

Body Width: 1.6 inch

Compact size allows for easy integration into tight spaces or small devices, making it versatile for different applications.

Power Supplies (V): 3/5

Compatibility with both 3V and 5V power supplies offers flexibility in system design and integration.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Multiple sensor types and output options provide versatility and compatibility with different systems and protocols.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and ease of installation in various configurations.

Body Height: 1.175 mm

Low profile design enables the sensor to be discreetly mounted or integrated into compact devices.

Package Shape or Style: RECTANGULAR

Rectangular shape makes it easy to mount and align the sensor with other components, simplifying installation and integration.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage ensures efficient power consumption and operation, saving energy and reducing costs.

Maximum Operating Temperature: 125 °C

Wide temperature range allows the sensor to function in harsh environments or extreme conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Ability to operate at low temperatures makes this sensor suitable for a wide range of applications, including cold storage or outdoor monitoring.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable connections and long-term performance, enhancing the sensor's durability and longevity.

Maximum Operating Current: 0.038 mA

Low operating current minimizes power consumption, extending the sensor's battery life and reducing overall power costs.

Housing: PLASTIC

Plastic housing provides a lightweight and durable enclosure for the sensor, ensuring protection against external impacts and environmental factors.

Maximum Accuracy °C: 2.5

High accuracy ensures precise temperature readings, making this sensor reliable for critical applications where accuracy is paramount.

Body Length/Diameter: 2.9 mm

Compact size allows for easy integration into small devices or tight spaces, making the sensor versatile for various applications.

Termination Type: SOLDER

Solder termination provides a secure and reliable connection method, ensuring stable signal transmission and preventing signal loss or interference.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with other devices, enabling seamless integration into existing systems or networks.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure mounting on PCBs or other surfaces, facilitating fast and efficient installation in a variety of applications.

Technical Specifications

Temperature Sensors TMP423AIDCNTG4 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

2.5

Body Width:

1.6 inch

Body Height:

1.175 mm

Body Length/Diameter:

2.9 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

12

No. of Terminals:

8

Maximum Operating Current:

.038 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSSOP8,.1

Package Shape or Style:

Power Supplies (V):

3/5

Sub-Category:

Other Sensors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Terminal Finish:

NICKEL PALLADIUM GOLD

Termination Type:

SOLDER

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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