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TMP411ADGKTG4

Texas Instruments

TMP411ADGKTG4 by Texas Instruments

TMP411ADGKTG4 by Texas Instruments is a 12-bit temperature sensor with a supply voltage range of 2.7V to 5.5V. It features a max operating temperature of 127°C and min of -55°C, suitable for various applications requiring precise temperature monitoring in compact spaces. The sensor comes in an 8-terminal square package ideal for surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 79,840 parts In-Stock

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Vyrian

USA . 7,217 parts In-Stock

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Digiode

USA . 1,958 parts In-Stock

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Parana Technologies

USA . 1,798 parts In-Stock

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$1.956

100+ parts

$181.665

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$1.761

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1,798

$1.956

$181.665

$1.761

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DigiPath Technology Company

USA . 2,312 parts In-Stock

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$2.154

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Corohmni

South Africa . 168 parts In-Stock

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$2.181

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ChromeModa Solutions

Germany . 1,952 parts In-Stock

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$2.198

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$1.802

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IDEA Electronic Components Group

UK . 1,315 parts In-Stock

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$2.198

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$1.978

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$2.598

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$2.468

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$2.468

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AZTECH Wire

Italy . 206 parts In-Stock

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$7.795

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One Stop Electronics

USA . 1,209 parts In-Stock

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$10.750

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Semicontronic

India . 1,548 parts In-Stock

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$20.750

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$20.231

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$20.128

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Ampacity Inc.

Singapore . 1,088 parts In-Stock

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$53.750

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Argo Parts USA

USA . 3,388 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 1,137 parts In-Stock

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Perfect Parts

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840

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Bastille Electronics

Australia . 57 parts In-Stock

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Overview

Discover the innovative TMP411ADGKTG4 by Texas Instruments, a top-quality temperature sensor that delivers precision and reliability. With a proven track record of excellence, Texas Instruments ensures that this sensor meets the highest industry standards. Ideal for a wide range of applications, this sensor provides accurate temperature readings with ease. Experience the value and benefits of this advanced technology, offering customers unmatched performance and peace of mind. Elevate your projects with the TMP411ADGKTG4 and trust in Texas Instruments for all your temperature sensing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes this temperature sensor lightweight and durable, ideal for various applications.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this sensor can be used in a wide range of electronic circuits without the risk of damage.

No. of Bits: 12

The 12-bit resolution allows for more precise temperature measurements, making this sensor suitable for high-accuracy applications.

Body Width: 3 inch

The compact 3-inch body width makes this sensor easy to integrate into tight spaces or small electronic devices.

Power Supplies (V): 3/5

This sensor can be powered using 3V or 5V supplies, offering flexibility in power source selection.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

The multiple sensor types available in this product provide versatile temperature sensing options for different applications.

No. of Terminals: 8

With 8 terminals, this sensor offers more connectivity options for interfacing with other electronic components.

Body Height: 1.1 mm

The low profile design of 1.1mm height makes this sensor suitable for applications where space is limited.

Package Shape or Style: SQUARE

The square package shape provides easy mounting and alignment for the sensor in circuit designs.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage of 2.7V enables this sensor to operate efficiently and accurately in low-power circuits.

Maximum Operating Temperature: 127 °C

With a high maximum operating temperature of 127°C, this sensor can withstand elevated temperatures in industrial environments.

Minimum Operating Temperature: -55 °C

The sensor can accurately measure temperatures as low as -55°C, making it suitable for cold temperature monitoring applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of Nickel/Palladium/Gold provides good conductivity and corrosion resistance, ensuring reliable connections.

Maximum Operating Current: 10 mA

The low operating current of 10mA helps in conserving power and reducing energy consumption in electronic systems.

Housing: PLASTIC

The plastic housing offers protection to the internal components and makes the sensor suitable for various environmental conditions.

Body Length/Diameter: 3 mm

The small body length/diameter of 3mm allows for easy placement and integration of the sensor in compact devices.

Temperature Coef (ppm/°C): POSITIVE

The positive temperature coefficient ensures more stable and accurate temperature readings with minimal errors.

Termination Type: SOLDER

The solder termination type provides a reliable and secure connection between the sensor and other components in the circuit.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the sensor's connectivity to microcontrollers or data acquisition systems for easy data transfer.

Mounting Feature: SURFACE MOUNT

The surface mounting feature makes it easy to install and secure the sensor onto PCBs, saving space and reducing assembly time.

Technical Specifications

Temperature Sensors TMP411ADGKTG4 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

1

Additional Features:

HYSTERESIS 500 MV

Body Width:

3 inch

Body Height:

1.1 mm

Body Length/Diameter:

3 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

12

No. of Terminals:

8

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

127 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSSOP8,.19

Package Shape or Style:

Power Supplies (V):

3/5

Sub-Category:

Other Sensors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Temperature Coef (ppm/Cel):

POSITIVE

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Termination Type:

SOLDER

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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