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TMP122AIDBVTG4

Texas Instruments

TMP122AIDBVTG4 by Texas Instruments

TMP122AIDBVTG4 by Texas Instruments is a 12-bit temperature sensor with SPI interface, operating b/w -40 to 125°C. It has a max accuracy of 1.5°C and requires a supply voltage of 2.7-5.5V. Ideal for applications requiring precise temperature monitoring in compact spaces with digital output needs.

Median Price

$1.740

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 226 parts In-Stock

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$1.740

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$1.590

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Bristol Electronics

USA . 165 parts In-Stock

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$2.736

100+ parts

$1.286

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$1.231

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Chip Stock

USA . 21,360 parts In-Stock

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Vyrian

USA . 5,345 parts In-Stock

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Digiode

USA . 3,777 parts In-Stock

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Prism Electronics

USA . 162 parts In-Stock

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Microfarads

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Distributors (Availability)

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Parana Technologies

USA . 1,329 parts In-Stock

1+ parts

$2.172

100+ parts

$201.666

1k+ parts

$1.954

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DigiPath Technology Company

USA . 2,041 parts In-Stock

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$2.391

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ChromeModa Solutions

Germany . 6,348 parts In-Stock

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$2.440

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$2.001

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$2.440

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$2.196

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Corphita

USA . 2,889 parts In-Stock

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Perfect Parts

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Overview

Discover the Texas Instruments TMP122AIDBVTG4, a top-quality temperature sensor designed to meet your precise needs. With Texas Instruments leading the way in innovation and reliability, this sensor is ideal for a variety of applications. From monitoring temperature in industrial settings to ensuring optimal performance in consumer electronics, this sensor offers unmatched accuracy and efficiency. Trust Texas Instruments for cutting-edge technology that delivers value and peace of mind. Choose the TMP122AIDBVTG4 for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the temperature sensor, making it suitable for various environments.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, allowing flexibility in different power supply configurations.

No. of Bits: 12

High resolution with 12 bits allows for precise temperature measurement and accurate data output.

Body Width: 1.6 inch

Compact size with a width of 1.6 inches makes the sensor easy to integrate into different devices and applications.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, providing versatility in power source options.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

Versatile sensor types that offer temperature sensing, digital output, and serial communication capabilities for diverse applications.

No. of Terminals: 6

Six terminals for easy connectivity and integration, ensuring a secure connection for reliable temperature readings.

Body Height: 1.45 mm

Low profile design with a height of 1.45 mm allows for space-saving installation in compact devices.

Package Shape or Style: RECTANGULAR

Rectangular package shape for easy mounting and secure placement in various electronic devices.

Minimum Supply Voltage: 2.7 V

Low minimum supply voltage of 2.7V for efficient power consumption and extended battery life.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in extreme temperature conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range capability from -40°C to 125°C for accurate temperature measurement in diverse environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish for corrosion resistance and reliable electrical connections.

Maximum Operating Current: 0.075 mA

Low maximum operating current of 0.075 mA for energy efficiency and minimal power consumption.

Housing: PLASTIC

Durable plastic housing for protection and robustness, suitable for various industrial and commercial applications.

Maximum Accuracy °C: 1.5

High accuracy of 1.5°C for precise temperature measurement and reliable data output.

Body Length/Diameter: 2.9 mm

Compact body length/diameter of 2.9 mm for easy integration and space-efficient design.

Termination Type: SOLDER

Solder termination type for secure electrical connections and easy installation in electronic circuits.

Output Interface Type: SPI INTERFACE

SPI interface for digital communication and easy data transfer between the sensor and connected devices.

Mounting Feature: SURFACE MOUNT

Surface mounting feature for easy and secure installation on PCBs or other surfaces.

Technical Specifications

Temperature Sensors TMP122AIDBVTG4 attributes and parameters. Explore more Temperature Sensors devices from Texas Instruments

Specs

Maximum Accuracy (Cel):

1.5

Body Width:

1.6 inch

Body Height:

1.45 mm

Body Length/Diameter:

2.9 mm

Housing:

PLASTIC

JESD-609 Code:

e4

Mounting Feature:

No. of Bits:

12

No. of Terminals:

6

Maximum Operating Current:

.075 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

SPI INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSOP6,.11,37

Package Shape or Style:

Power Supplies (V):

3/5

Sub-Category:

Other Sensors/Transducers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Terminal Finish:

NICKEL PALLADIUM GOLD

Termination Type:

SOLDER

Trade Compliance

TMP122AIDBVTG4 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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