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TMDXEVM5515

Texas Instruments

TMDXEVM5515 by Texas Instruments

TMDXEVM5515 by Texas Instruments is an Evaluation Platform for C5000™ series DSP. It features Embedded MCU, DSP Evaluation Boards with TMS320C55x IC. The package includes Board(s), Cable(s), OLED, Power Supply and is suitable for fixed mounting applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,252 parts In-Stock

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Digiode

USA . 3,845 parts In-Stock

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AZTECH Wire

Italy . 393 parts In-Stock

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$13.351

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Semicontronic

India . 1,539 parts In-Stock

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$162.100

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$158.048

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$157.237

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Ampacity Inc.

Singapore . 1,188 parts In-Stock

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$212.100

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One Stop Electronics

USA . 881 parts In-Stock

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ChromeModa Solutions

Germany . 3,833 parts In-Stock

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Corphita

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Parana Technologies

USA . 921 parts In-Stock

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IDEA Electronic Components Group

UK . 403 parts In-Stock

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Corohmni

South Africa . 303 parts In-Stock

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DigiPath Technology Company

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Overview

Discover the power of the TMDXEVM5515 by Texas Instruments, a top-notch development board that offers unparalleled quality and reliability. This versatile device is perfect for a wide range of applications in the embedded MCU and DSP evaluation field. With Texas Instruments at the helm, you can trust in the superior craftsmanship and cutting-edge technology that goes into every product they create. The TMDXEVM5515 provides exceptional value and benefits to customers, allowing them to streamline their development process and bring their innovative ideas to life with ease. Upgrade your projects today with the TMDXEVM5515 and experience the difference for yourself.

Feature Benefit Bullets

Other Names: 296-25753

This specific part number makes it easier for customers to identify and purchase the correct evaluation board for their needs.

Category: Development Boards, Kits, Programmers; Evaluation Boards; Embedded MCU, DSP Evaluation Boards

This product falls under multiple categories, indicating its versatility and suitability for a wide range of applications involving embedded MCU and DSP evaluation.

Series: C5000™

Being part of the C5000 series indicates that this board is designed for high-performance DSP applications, ensuring reliable and efficient operation.

Package: Box

The box packaging provides protection for the board and its components during transportation and storage, ensuring that the product arrives in good condition.

Type: DSP

As a DSP evaluation board, this product is specifically designed for testing and developing applications related to digital signal processing, making it a valuable tool for engineers in this field.

Utilized IC/Part: TMS320C55x

The TMS320C55x is a powerful DSP processor known for its high performance and efficiency. By using this IC, the evaluation board can deliver impressive processing capabilities.

Mounting Type: Fixed

The fixed mounting type ensures stability and reliability during operation, making it suitable for testing and developing applications that require consistent performance.

Contents: Board(s), Cable(s), OLED, Power Supply

The inclusion of essential components such as the board, cables, OLED display, and power supply enhances the usability of the evaluation platform, providing everything needed for testing and development.

Board Type: Evaluation Platform

As an evaluation platform, this board is specifically designed for testing and assessing the performance of the TMS320C55x DSP, making it a valuable tool for engineers and developers working on DSP applications.

Base Product Number: TMDX

The base product number TMDX indicates that this board is part of a series of evaluation platforms, ensuring compatibility and consistency across related products.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL rating of 1 (Unlimited) indicates that this board is not sensitive to moisture, providing greater reliability and reducing the risk of damage during storage and use in various environments.

Technical Specifications

Additional Parts TMDXEVM5515 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-25753

Series:

C5000™

Type:

DSP

Category:

Development Boards, Kits, Programmers
Evaluation Boards Embedded MCU, DSP Evaluation Boards

Contents:

Board(s), Cable(s), OLED, Power Supply

Board Type:

Evaluation Platform

Utilized IC / Part:

TMS320C55x

Package:

Box

Mounting Type:

Fixed

Standard Package:

1

Base Product Number:

TMDX

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TMDXEVM5515 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8471.50.0150

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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