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TMDSEVM642

Texas Instruments

TMDSEVM642 by Texas Instruments

TMDSEVM642 by Texas Instruments is an Evaluation Platform for C64x DSP core processor. It features Embedded MCU, DSP Evaluation Boards from C6000™, DaVinci™, VelociTI.2™ series. The package includes Board(s), Cable(s), Power Supply and is ideal for developing applications requiring high-performance signal processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 4,835 parts In-Stock

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Vyrian

USA . 4,483 parts In-Stock

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AZTECH Wire

Italy . 452 parts In-Stock

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$19.257

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Component Stockers USA

USA . 225 parts In-Stock

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$99.990

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Semicontronic

India . 1,180 parts In-Stock

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$132.100

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$128.798

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$128.137

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One Stop Electronics

USA . 1,429 parts In-Stock

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Ampacity Inc.

Singapore . 534 parts In-Stock

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$242.100

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ChromeModa Solutions

Germany . 4,811 parts In-Stock

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IDEA Electronic Components Group

UK . 1,863 parts In-Stock

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Corphita

USA . 1,085 parts In-Stock

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DigiPath Technology Company

USA . 870 parts In-Stock

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Parana Technologies

USA . 367 parts In-Stock

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Corohmni

South Africa . 210 parts In-Stock

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Perfect Parts

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Overview

Experience the power of cutting-edge technology with the TMDSEVM642 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that meet the highest standards. The TMDSEVM642 falls under the category of Development Boards and Evaluation Boards, making it an essential tool for those working with Embedded MCUs and DSPs. With a focus on innovation and reliability, this product offers unparalleled value to customers looking to streamline their development process and bring their projects to the next level. Unlock new possibilities and unleash your creativity with the TMDSEVM642.

Feature Benefit Bullets

Other Names: 296-23058, TMDSEVM642-ND

Multiple reference names make it easy to identify and order the correct product

Category: Development Boards, Kits, Programmers, Evaluation Boards

This product falls under various categories, indicating its versatility and usefulness for development and evaluation purposes

Embedded MCU, DSP Evaluation Boards Series: C6000™, DaVinci™, VelociTI.2™

Compatible with a variety of series, offering flexibility in usage and compatibility with different systems

Package: Bulk

Available in bulk packaging, making it convenient for purchasing multiple units or for commercial use

Type: DSP

Designed specifically for digital signal processing tasks, ensuring efficient performance in processing audio and video signals

Core Processor: C64x

Utilizes the C64x core processor for high-performance computing and processing capabilities

Utilized IC / Part: TMS320DM642

Incorporates the TMS320DM642 IC, known for its reliable and efficient performance in digital signal processing applications

Mounting Type: Fixed

Fixed mounting type ensures stability and secure installation of the evaluation board during testing and development

Contents: Board(s), Cable(s), Power Supply

Comes with essential components including board, cables, and power supply, providing users with everything they need to get started with evaluation and development

Board Type: Evaluation Platform

Designed as an evaluation platform for testing and assessing the performance of the DSP, allowing users to optimize their applications

Base Product Number: TMDS

Based on the TMDS product line, known for its quality and reliability in the field of development boards and evaluation platforms

Moisture Sensitivity Level (MSL): 1 (Unlimited)

High moisture sensitivity level ensures the product is not easily affected by moisture during storage or usage, increasing its durability and reliability

Technical Specifications

Additional Parts TMDSEVM642 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Core Processor:

C64x

Other Names:

296-23058
TMDSEVM642-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Embedded MCU, DSP Evaluation Boards

Mounting Type:

Fixed

Standard Package:

1

Series:

C6000™, DaVinci™, VelociTI.2™

Type:

DSP

Contents:

Board(s), Cable(s), Power Supply

Board Type:

Evaluation Platform

Utilized IC / Part:

TMS320DM642

Package:

Bulk

Base Product Number:

TMDS

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TMDSEVM642 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

3A991A2

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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