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TMDSEVM3517C

Texas Instruments

TMDSEVM3517C by Texas Instruments

TMDSEVM3517C by Texas Instruments is an ARM Cortex-A8 based MPU evaluation board. It features AM3505 and AM3517 ICs, with fixed mounting and LCD display. This Sitara series development board is ideal for evaluating embedded MCU and DSP applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,511 parts In-Stock

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Digiode

USA . 1,781 parts In-Stock

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AZTECH Wire

Italy . 669 parts In-Stock

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$9.302

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Ampacity Inc.

Singapore . 1,442 parts In-Stock

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$36.100

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One Stop Electronics

USA . 788 parts In-Stock

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$123.100

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Semicontronic

India . 201 parts In-Stock

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$155.100

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$151.222

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$150.447

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201

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Lixinc

USA . 9,393 parts In-Stock

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ChromeModa Solutions

Germany . 6,343 parts In-Stock

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Corphita

USA . 3,860 parts In-Stock

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DigiPath Technology Company

USA . 1,836 parts In-Stock

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IDEA Electronic Components Group

UK . 1,585 parts In-Stock

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Corohmni

South Africa . 486 parts In-Stock

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Parana Technologies

USA . 283 parts In-Stock

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Overview

Elevate your development projects with the TMDSEVM3517C by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled quality and innovation. This evaluation board is perfect for exploring the capabilities of ARM Cortex-A8 processors like the AM3505 and AM3517. Whether you're working on embedded MCU or DSP applications, this product offers immense value and benefits. With its comprehensive contents including LCD display, the TMDSEVM3517C is the perfect tool to accelerate your project development. Experience the advantages of Texas Instruments technology today.

Feature Benefit Bullets

Other Names TMDSEVM3517C-ND, 296-45879

These names help in identifying the product uniquely and ordering easily.

Category

Being in the category of Development Boards, Kits, and Programmers, this product is designed for evaluation and testing of MCU and DSP applications.

Series

Part of the Sitara™ series known for high performance and low power consumption, ensuring efficient operation.

Package

Comes in a box package, providing protection during shipping and storage.

Type

MPU type indicates that it is a Microprocessor Unit, suitable for processing applications efficiently.

Core Processor

Powered by ARM® Cortex®-A8 processor, offering high performance and low power consumption for various applications.

Utilized IC / Part

Using AM3505 and AM3517 parts ensures compatibility and optimized performance for specific applications and functionalities.

Mounting Type

Fixed mounting type provides stability and ease of installation within a system.

Contents

Includes board(s) and LCD display, making it a complete evaluation platform for testing and development.

Board Type

Evaluation Platform board type allows for easy testing, programming, and evaluation of the integrated components.

Base Product Number

Belonging to the TMDS product line ensures quality and compatibility with other products in the same series.

Moisture Sensitivity Level (MSL)

Having MSL 1 (Unlimited) means the product is not sensitive to moisture, ensuring reliability in various environmental conditions.

Technical Specifications

Additional Parts TMDSEVM3517C attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Core Processor:

ARM® Cortex®-A8

Other Names:

TMDSEVM3517C-ND
296-45879

Category:

Development Boards, Kits, Programmers
Evaluation Boards Embedded MCU, DSP Evaluation Boards

Mounting Type:

Fixed

Standard Package:

1

Series:

Sitara™

Type:

MPU

Contents:

Board(s), LCD

Board Type:

Evaluation Platform

Utilized IC / Part:

AM3505, AM3517

Package:

Box

Base Product Number:

TMDS

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TMDSEVM3517C Miscellaneous Components trade compliance attributes, and parameters.

ECCN

5A992C

HTS

8473.30.1180

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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