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TLVH431BQDBVRE4

Texas Instruments

TLVH431BQDBVRE4 by Texas Instruments

THREE TERMINAL VOLTAGE REFERENCE; Temperature Grade: AUTOMOTIVE; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,552 parts In-Stock

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Vyrian

USA . 3,142 parts In-Stock

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3,142

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,486 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,486

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,407 parts In-Stock

1+ parts

$2.500

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1,407

$2.500

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Parana Technologies

USA . 1,939 parts In-Stock

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$5.095

100+ parts

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$5.675

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1,939

$5.095

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$5.675

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DigiPath Technology Company

USA . 1,858 parts In-Stock

1+ parts

$5.610

100+ parts

$5.162

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1,858

$5.610

$5.162

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ChromeModa Solutions

Germany . 3,002 parts In-Stock

1+ parts

$5.725

100+ parts

$4.694

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3,002

$5.725

$4.694

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

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$5.725

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$5.152

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1,261

$5.725

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One Stop Electronics

USA . 588 parts In-Stock

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$6.500

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588

$6.500

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AZTECH Wire

Italy . 221 parts In-Stock

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$9.402

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Microchip USA

USA . 1,547 parts In-Stock

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1,547

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Corphita

USA . 323 parts In-Stock

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Corohmni

South Africa . 216 parts In-Stock

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Technical Specifications

Voltage References TLVH431BQDBVRE4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

Additional Features:

OUTPUT VOLTAGE ADJUSTABLE FROM 1.24V TO 18V

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.08 A

Maximum Output Voltage:

1.246 V

Minimum Output Voltage:

1.234 V

Nominal Output Voltage:

1.24 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

1.24 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

151.515 ppm/Cel

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trim or Adjustable Output (V):

YES

Maximum Voltage Tolerance:

.5 %

Width (mm):

1.6 mm

Trade Compliance

TLVH431BQDBVRE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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