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TLV9002IDDFR

Texas Instruments

TLV9002IDDFR by Texas Instruments

TLV9002IDDFR by Texas Instruments is a CMOS Operational Amplifier with 2 functions, Vsup of 5V, and Unity Gain Bandwidth of 1MHz. Ideal for automotive applications due to low-bias design, it offers high Common Mode Reject Ratio and operates at temperatures ranging from -40 to 125°C.

Median Price

$0.222

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 154,762 parts In-Stock

1+ parts

$0.120

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$0.120

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Mouser Electronics

USA . 4,132 parts In-Stock

1+ parts

$0.660

100+ parts

$0.368

1k+ parts

$0.315

10k+ parts

$0.293

4,132

$0.660

$0.368

$0.315

$0.293

DigiKey

USA . 20,422 parts In-Stock

1+ parts

-

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$0.288

20,422

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$0.288

Arrow

USA . 9,000 parts In-Stock

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$0.157

9,000

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$0.157

Distributors (In-Stock)

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Digiode

USA . 896 parts In-Stock

1+ parts

$0.114

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896

$0.114

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Nova Conductors

Japan . 10 parts In-Stock

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$0.282

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10

$0.282

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Maritex

Poland . 1,314 parts In-Stock

1+ parts

$1.513

100+ parts

$0.339

1k+ parts

$0.218

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1,314

$1.513

$0.339

$0.218

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Chip Stock

USA . 97,687 parts In-Stock

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Vyrian

USA . 45,770 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Semicontronic

India . 45,895 parts In-Stock

1+ parts

$0.102

100+ parts

$0.099

1k+ parts

$0.099

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45,895

$0.102

$0.099

$0.099

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Ampacity Inc.

Singapore . 45,635 parts In-Stock

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$0.102

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$0.102

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Corphita

USA . 1,673 parts In-Stock

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$0.108

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$0.108

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Continental Prestige Electronics

USA . 6,234 parts In-Stock

1+ parts

$0.177

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$0.173

6,234

$0.177

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$0.173

Argo Parts USA

USA . 4,243 parts In-Stock

1+ parts

$0.177

100+ parts

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$0.171

4,243

$0.177

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$0.171

Modulus Dynamics

Lithuania . 450 parts In-Stock

1+ parts

$0.224

100+ parts

$0.222

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$0.215

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450

$0.224

$0.222

$0.215

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.282

100+ parts

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$0.267

10k+ parts

$0.262

2,000

$0.282

-

$0.267

$0.262

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$1.616

100+ parts

$1.535

1k+ parts

$1.535

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40

$1.616

$1.535

$1.535

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Parana Technologies

USA . 997 parts In-Stock

1+ parts

$5.096

100+ parts

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$5.678

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997

$5.096

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$5.678

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Corohmni

South Africa . 341 parts In-Stock

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$5.287

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341

$5.287

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ChromeModa Solutions

Germany . 6,744 parts In-Stock

1+ parts

$5.726

100+ parts

$4.695

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6,744

$5.726

$4.695

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IDEA Electronic Components Group

UK . 732 parts In-Stock

1+ parts

$5.726

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$5.153

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732

$5.726

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Lixinc

USA . 8,420 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 4,800 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,594 parts In-Stock

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DigiPath Technology Company

USA . 1,662 parts In-Stock

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$5.163

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$6.970

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$6.970

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$6.970

500

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$6.970

$6.970

$6.970

A-Z Elektronik GmbH

Germany . 274 parts In-Stock

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274

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Overview

Elevate your projects with the TLV9002IDDFR by Texas Instruments, a top-tier operational amplifier designed for precision and reliability. Crafted by the industry-leading manufacturer, Texas Instruments, this op amp offers unparalleled quality and performance in a compact package. Ideal for a wide range of applications, the TLV9002IDDFR delivers exceptional value with its micropower technology, low-bias operation, and high-frequency compensation. Experience enhanced efficiency and accuracy in your designs with this cutting-edge amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for long-term use.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures accurate signal processing.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Nominal Common Mode Reject Ratio: 95 dB

High common mode reject ratio ensures better noise rejection and signal integrity.

Nominal Supply Voltage: 5V

Operates on a standard 5V power supply, making it compatible with many systems.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for various industrial applications.

Frequency Compensation: YES

Frequency compensation ensures stability and performance across different frequency ranges.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed specifically for amplification and signal processing applications, ensuring accurate output.

Technical Specifications

Operational Amplifiers (Op Amps) TLV9002IDDFR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

95 dB

Minimum Common Mode Rejection Ratio (CMRR ):

63 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

158489

Nominal Slew Rate:

2 V/us

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

150 μA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.11

Trade Compliance

TLV9002IDDFR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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