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TLV9001SIDCKR

Texas Instruments

TLV9001SIDCKR by Texas Instruments

TLV9001SIDCKR by Texas Instruments is a CMOS operational amplifier with a max input offset voltage of 2000 uV. It has a nominal common mode reject ratio of 95 dB and operates at a supply voltage of 5 V. This amplifier is commonly used in automotive applications due to its low-bias and micropower features.

Median Price

$0.272

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 125,071 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

-

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125,071

$0.088

-

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DigiKey

USA . 7,325 parts In-Stock

1+ parts

$0.410

100+ parts

$0.219

1k+ parts

$0.185

10k+ parts

-

7,325

$0.410

$0.219

$0.185

-

Mouser Electronics

USA . 4,401 parts In-Stock

1+ parts

$0.410

100+ parts

$0.220

1k+ parts

$0.185

10k+ parts

$0.169

4,401

$0.410

$0.220

$0.185

$0.169

Chip1Stop

Japan . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$0.134

6,000

-

-

-

$0.134

Distributors (In-Stock)

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Digiode

USA . 3,943 parts In-Stock

1+ parts

$0.084

100+ parts

-

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3,943

$0.084

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.259

100+ parts

-

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500

$0.259

-

-

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Maritex

Poland . 2,746 parts In-Stock

1+ parts

$0.350

100+ parts

$0.180

1k+ parts

-

10k+ parts

$0.144

2,746

$0.350

$0.180

-

$0.144

Vyrian

USA . 34,880 parts In-Stock

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34,880

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Chip Stock

USA . 17,510 parts In-Stock

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Semicontronic

India . 34,771 parts In-Stock

1+ parts

$0.075

100+ parts

$0.073

1k+ parts

$0.073

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-

34,771

$0.075

$0.073

$0.073

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Corphita

USA . 868 parts In-Stock

1+ parts

$0.079

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868

$0.079

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Ampacity Inc.

Singapore . 34,707 parts In-Stock

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$0.163

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$0.163

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Continental Prestige Electronics

USA . 4,957 parts In-Stock

1+ parts

$0.259

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$0.254

4,957

$0.259

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$0.254

Argo Parts USA

USA . 260 parts In-Stock

1+ parts

$0.259

100+ parts

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$0.252

260

$0.259

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$0.252

Netroflash

USA . 100 parts In-Stock

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$0.259

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100

$0.259

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Parana Technologies

USA . 1,089 parts In-Stock

1+ parts

$3.245

100+ parts

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$3.766

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1,089

$3.245

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$3.766

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IDEA Electronic Components Group

UK . 1,078 parts In-Stock

1+ parts

$3.646

100+ parts

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$3.281

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1,078

$3.646

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$3.281

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ChromeModa Solutions

Germany . 568 parts In-Stock

1+ parts

$3.646

100+ parts

$2.990

1k+ parts

-

10k+ parts

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568

$3.646

$2.990

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Corohmni

South Africa . 288 parts In-Stock

1+ parts

$3.726

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288

$3.726

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$6.366

100+ parts

$6.048

1k+ parts

$6.048

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2,500

$6.366

$6.048

$6.048

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Lixinc

USA . 15,664 parts In-Stock

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15,664

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DigiPath Technology Company

USA . 1,619 parts In-Stock

1+ parts

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$3.287

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1,619

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$3.287

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Overview

Discover the TLV9001SIDCKR by Texas Instruments, a high-quality operational amplifier designed to enhance performance and reliability. Manufactured by Texas Instruments, a leading provider of innovative semiconductor solutions, this op amp offers numerous advantages for various applications. With its small outline, thin profile package style, and surface mount capability, it is perfect for space-constrained designs. Boasting a nominal common mode reject ratio of 95 dB and a wide supply voltage range of up to 7V, this amplifier delivers superior performance in automotive and industrial settings. Experience the value, benefits, and advantages that the TLV9001SIDCKR brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product is made with a durable plastic/epoxy material, providing reliability and longevity.

Maximum Input Offset Voltage: 2000 uV

The low maximum input offset voltage ensures accurate and precise amplification, making this product suitable for precision applications.

Surface Mount: YES

With surface mount capabilities, this product can be easily and securely mounted onto circuit boards, facilitating streamlined and efficient assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for effective space utilization, maximizing the integration potential of this product in compact designs.

Nominal Common Mode Reject Ratio: 95 dB

The high nominal common mode reject ratio enhances the ability of this product to eliminate unwanted common-mode signals, resulting in improved signal integrity.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product is compatible with standard power sources, providing versatility and widespread usability.

No. of Terminals: 6

The 6 terminal configuration offers sufficient connectivity options, allowing for flexible circuit configurations and integration into various systems.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

With a small outline, thin profile, and shrink pitch package style, this product can be easily incorporated into space-constrained applications without compromising performance.

Maximum Supply Voltage Limit: 7V

The maximum supply voltage limit of 7V ensures safe operation and protection against voltage fluctuations, guaranteeing the reliability and longevity of this product.

Maximum Operating Temperature: 125 °C

The wide maximum operating temperature range of 125°C enables this product to withstand harsh environmental conditions, making it suitable for demanding industrial or automotive applications.

Frequency Compensation: YES

The presence of frequency compensation ensures stable operation and minimizes the potential for oscillations, enhancing the overall performance and reliability of this product.

Minimum Voltage Gain: 158489

With a minimum voltage gain of 158489, this product provides substantial amplification capabilities, making it well-suited for applications requiring high gain.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this product to function reliably in cold environments, expanding its applicability across various industries.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good electrical conductivity and corrosion resistance, ensuring reliable connections and prolonged product lifespan.

Terminal Position: DUAL

The dual terminal position enhances compatibility with various circuit arrangements and simplifies interconnections, facilitating ease of use and installation.

Maximum Seated Height: 1.1 mm

With a maximum seated height of 1.1mm, this product occupies minimal space in compact designs, enabling efficient use of available circuit board real estate.

Width: 1.25 mm

The narrow width of 1.25mm allows for compact integration and facilitates the design of smaller and more portable electronic devices.

Micropower: YES

The micropower feature ensures low power consumption, making this product ideal for battery-powered applications and prolonging battery life.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum allowable time of 30 seconds at peak reflow temperature, this product can withstand typical soldering processes, enabling easier assembly and production.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows this product to withstand soldering processes with high melting point solders, ensuring secure and reliable connections.

Length: 2 mm

The compact length of 2mm enables the placement of this product in space-restricted environments, expanding its potential applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the strict temperature and reliability requirements of the automotive industry, making it suitable for automotive electronics.

Low-Bias: YES

The low-bias feature minimizes input/output offset, maximizing accuracy and precision in amplification tasks, rendering this product suitable for high-precision applications.

Nominal Unity Gain Bandwidth: 1000 kHz

With a nominal unity gain bandwidth of 1000 kHz, this product can accurately amplify signals within a wide range of frequencies, making it versatile for diverse audio and signal processing applications.

Minimum Common Mode Reject Ratio: 63 dB

The minimum common mode reject ratio of 63 dB ensures effective suppression of common-mode signals, enhancing the purity and integrity of the amplified signal.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high input impedance, and high-speed operation, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical support, ensuring secure and reliable connections, minimizing the risk of signal loss or electrical discontinuity.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is specifically designed for precision amplification applications, offering high gain, low noise, and excellent linearity.

Maximum Supply Current: 0.077 mA

With a low maximum supply current of 0.077 mA, this product exhibits excellent energy efficiency, ideal for low-power and battery-powered systems.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture ensures stability, accurate amplification, and wide bandwidth, making this product suitable for demanding applications requiring high performance.

Packing Method: TR

The TR packing method provides industry-standard packaging, ensuring ease of handling, transportation, and compatibility with automated manufacturing processes.

Nominal Slow Rate: 2 V/us

With a nominal slow rate of 2 V/μs, this product delivers a controlled, smooth amplification response, particularly useful in audio applications where gradual signal changes are desired.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65mm allows for compact integration and facilitates precise soldering, enhancing the overall durability and reliability of this product.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this product can withstand a moderate level of moisture exposure, ensuring its usability and reliability in various environments.

Technical Specifications

Operational Amplifiers (Op Amps) TLV9001SIDCKR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

95 dB

Minimum Common Mode Rejection Ratio (CMRR ):

63 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

158489

Nominal Slew Rate:

2 V/us

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

77 μA

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP6,.08

Trade Compliance

TLV9001SIDCKR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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