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TLV3704IDG4

Texas Instruments

TLV3704IDG4 by Texas Instruments

TLV3704IDG4 by Texas Instruments is a CMOS comparator with 4 functions, featuring a max input offset voltage of 7000 uV and a max average bias current of 0.0015 uA. With a small outline package style, it is ideal for automotive applications requiring precise voltage comparisons in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,427 parts In-Stock

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Digiode

USA . 489 parts In-Stock

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489

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Distributors (Availability)

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Parana Technologies

USA . 112 parts In-Stock

1+ parts

$2.501

100+ parts

-

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$2.991

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112

$2.501

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$2.991

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DigiPath Technology Company

USA . 2,260 parts In-Stock

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$2.754

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$2.533

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$2.754

$2.533

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

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$2.810

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$2.529

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$2.810

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$2.529

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ChromeModa Solutions

Germany . 375 parts In-Stock

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$2.810

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$2.304

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375

$2.810

$2.304

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One Stop Electronics

USA . 380 parts In-Stock

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$3.410

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380

$3.410

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AZTECH Wire

Italy . 844 parts In-Stock

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$19.056

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844

$19.056

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Microchip USA

USA . 3,517 parts In-Stock

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Corphita

USA . 2,883 parts In-Stock

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Overview

Experience superior performance and reliability with the TLV3704IDG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality comparators like this one, perfect for a wide range of applications. With its precise operation and efficient design, this comparator offers unmatched value and benefits to customers. Trust in Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations. Choose the TLV3704IDG4 for exceptional performance every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the comparator, ensuring long-lasting performance.

Maximum Input Offset Voltage: 7000 uV

High input offset voltage allows for accurate comparison of input signals in various applications.

Maximum Average Bias Current (IIB): 0.0015 uA

Low bias current ensures minimal power consumption and enhances the efficiency of the comparator.

Surface Mount: YES

Surface mount capability offers easy installation and saves space on the PCB, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

Stable nominal supply voltage ensures consistent performance of the comparator under specified operating conditions.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows the comparator to function reliably in various environments, including high-temperature conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the comparator suitable for battery-powered applications and noise-sensitive circuits.

Technical Specifications

Comparators TLV3704IDG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

±1.35/±8/2.7/16 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

7 mV

Peak Bias Current:

1.5 nA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Maximum Supply Current:

3.2 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

17 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

240 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLV3704IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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