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TLV320AIC33EVM-PDK

Texas Instruments

TLV320AIC33EVM-PDK by Texas Instruments

TLV320AIC33EVM-PDK by Texas Instruments is an Audio CODEC with Stereo, 16-32-Bit, 8-96kHz Sample Rates. It falls under Development Boards for Evaluation and Demonstration. The package includes Board(s) with a Graphical User Interface (GUI), ideal for audio applications requiring high-quality sound processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,300 parts In-Stock

1+ parts

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7,300

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Digiode

USA . 2,855 parts In-Stock

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2,855

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 415 parts In-Stock

1+ parts

$13.479

100+ parts

-

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415

$13.479

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One Stop Electronics

USA . 1,555 parts In-Stock

1+ parts

$38.100

100+ parts

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1,555

$38.100

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Component Stockers USA

USA . 576 parts In-Stock

1+ parts

$99.990

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576

$99.990

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Ampacity Inc.

Singapore . 1,362 parts In-Stock

1+ parts

$128.100

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1,362

$128.100

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Semicontronic

India . 1,127 parts In-Stock

1+ parts

$187.100

100+ parts

$182.422

1k+ parts

$181.487

10k+ parts

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1,127

$187.100

$182.422

$181.487

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ChromeModa Solutions

Germany . 2,176 parts In-Stock

1+ parts

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2,176

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Parana Technologies

USA . 1,866 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.059

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1,866

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$0.059

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DigiPath Technology Company

USA . 1,339 parts In-Stock

1+ parts

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1,339

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IDEA Electronic Components Group

UK . 894 parts In-Stock

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894

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Corphita

USA . 132 parts In-Stock

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132

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Corohmni

South Africa . 130 parts In-Stock

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130

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Perfect Parts

USA . 3 parts In-Stock

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3

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Overview

Experience superior audio quality with the TLV320AIC33EVM-PDK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch development boards and kits like this one, designed for evaluation and demonstration purposes. This audio codec board offers stereo sound with sample rates ranging from 8 to 96kHz, making it perfect for a variety of applications. With a user-friendly graphical interface and high-quality performance, the TLV320AIC33EVM-PDK provides exceptional value and benefits to customers looking to enhance their audio projects.

Feature Benefit Bullets

Other Names: 296-21125-NDR

Easy to identify and find in industry databases

Category: Development Boards, Kits, Programmers

Provides tools for evaluation and development of audio applications

Package: Box

Offers protection and organization for the components

Type: Audio

Designed specifically for audio applications

Function: CODEC

Integrates analog-to-digital and digital-to-analog conversion for audio signals

Utilized IC / Part: TLV320AIC33

Utilizes a specific integrated circuit for high-quality audio processing

Primary Attributes: Stereo, 16 ~ 32-Bit, 8 ~ 96kHz Sample Rates

Supports various audio formats and sample rates for flexibility

Supplied Contents: Board(s)

Comes with necessary components for immediate use

Secondary Attributes: Graphical User Interface (GUI)

Provides a user-friendly interface for configuration and control

Base Product Number: TLV320

Part of a product line for compatibility and expansion options

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and used in various environments without risk of damage

Technical Specifications

Additional Parts TLV320AIC33EVM-PDK attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-21125-NDR
-296-21125
-TLV320AIC33EVM-PDK-NDR
296-21125
-296-21125-ND
TLV320AIC33EVMPDK

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Function:

CODEC

Type:

Audio

Supplied Contents:

Board(s)

Secondary Attributes:

Graphical User Interface (GUI)

Utilized IC / Part:

TLV320AIC33

Package:

Box

Embedded:

No

Primary Attributes:

Stereo, 16 ~ 32-Bit, 8 ~ 96kHz Sample Rates

Base Product Number:

TLV320

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLV320AIC33EVM-PDK Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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