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TLV320AIC3120EVM-U

Texas Instruments

TLV320AIC3120EVM-U by Texas Instruments

TLV320AIC3120EVM-U by Texas Instruments is an Audio CODEC evaluation board with Class-D Speaker Terminals and Headphone Output. It comes in a box package and includes on-board LEDs for visual feedback. Ideal for testing and demonstrating audio functionalities of the TLV320AIC3120 IC in various applications.

Median Price

$118.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29 parts In-Stock

1+ parts

$99.000

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29

$99.000

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DigiKey

USA . 9 parts In-Stock

1+ parts

$118.800

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9

$118.800

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$118.810

100+ parts

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2

$118.810

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,817 parts In-Stock

1+ parts

$94.050

100+ parts

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1,817

$94.050

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Vyrian

USA . 2,920 parts In-Stock

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2,920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14 parts In-Stock

1+ parts

$84.150

100+ parts

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14

$84.150

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Semicontronic

India . 14 parts In-Stock

1+ parts

$84.150

100+ parts

$82.046

1k+ parts

$81.626

10k+ parts

-

14

$84.150

$82.046

$81.626

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Corphita

USA . 2,145 parts In-Stock

1+ parts

$89.100

100+ parts

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2,145

$89.100

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Corohmni

South Africa . 92 parts In-Stock

1+ parts

$99.000

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92

$99.000

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ChromeModa Solutions

Germany . 4,834 parts In-Stock

1+ parts

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4,834

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Parana Technologies

USA . 1,897 parts In-Stock

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$0.368

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1,897

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$0.368

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DigiPath Technology Company

USA . 1,783 parts In-Stock

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1,783

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

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1,158

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Overview

Unlock the power of audio with the TLV320AIC3120EVM-U by Texas Instruments. As a leader in the industry, Texas Instruments delivers quality and innovation in every product. The TLV320AIC3120EVM-U is a versatile development board that opens up a world of possibilities for audio applications. With features like Class-D Speaker Terminals and Headphone Output, this board offers top-notch performance. Whether you're a seasoned professional or a hobbyist, this board will take your projects to the next level. Experience the value and benefits of the TLV320AIC3120EVM-U and elevate your audio creations today.

Feature Benefit Bullets

Other Names: TLV320AIC3120EVM-U-ND, 296-31037

Easy to identify and find in inventory with multiple names.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

Versatile use for development and evaluation purposes.

Package: Box

Protects the product during shipping and storage.

Type: Audio

Designed specifically for audio applications.

Function: CODEC

High-quality audio codec functionality for accurate sound reproduction.

Utilized IC / Part: TLV320AIC3120

Utilizes a reliable and well-known audio IC for performance.

Primary Attributes: Class-D Speaker Terminals, Headphone Output

Provides multiple output options for different audio devices.

Supplied Contents: Board(s)

Includes necessary boards for immediate use.

Secondary Attributes: On-Board LEDs

Enhances user experience with visual indicators.

Base Product Number: TLV320

Part of a series of products with consistent quality and performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Resistant to moisture damage, ensuring product longevity.

Technical Specifications

Additional Parts TLV320AIC3120EVM-U attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

TLV320AIC3120EVM-U-ND
296-31037
TLV320AIC3120EVMU

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Function:

CODEC

Type:

Audio

Supplied Contents:

Board(s)

Secondary Attributes:

On-Board LEDs

Utilized IC / Part:

TLV320AIC3120

Package:

Box

Embedded:

No

Primary Attributes:

Class-D Speaker Terminals, Headphone Output

Base Product Number:

TLV320

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TLV320AIC3120EVM-U Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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