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TLV3201AIDBV

Texas Instruments

TLV3201AIDBV by Texas Instruments

TLV3201AIDBV by Texas Instruments is a comparator with 6000uV max input offset voltage, 0.005uA max average bias current, and 47ns nominal response time. Widely used in automotive applications due to its push-pull output type and -40 to 125 °C operating temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,530 parts In-Stock

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Digiode

USA . 2,573 parts In-Stock

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Nova Conductors

Japan . 31 parts In-Stock

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Ampacity Inc.

Singapore . 1,455 parts In-Stock

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$0.410

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$0.410

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One Stop Electronics

USA . 1,452 parts In-Stock

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$2.410

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$2.410

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Corohmni

South Africa . 236 parts In-Stock

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$2.421

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$2.421

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Semicontronic

India . 718 parts In-Stock

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$4.410

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$4.300

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$4.278

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718

$4.410

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$4.278

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Parana Technologies

USA . 639 parts In-Stock

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$4.734

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$5.231

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639

$4.734

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Advanced Electronics

New Zealand . 10 parts In-Stock

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$4.915

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$4.473

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$4.030

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10

$4.915

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$4.030

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DigiPath Technology Company

USA . 2,129 parts In-Stock

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$5.213

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$4.796

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ChromeModa Solutions

Germany . 3,366 parts In-Stock

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$5.319

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$4.362

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IDEA Electronic Components Group

UK . 2,043 parts In-Stock

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$4.787

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AZTECH Wire

Italy . 346 parts In-Stock

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$7.047

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Infinite Electronics LLP (Excess)

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Lixinc

USA . 7,216 parts In-Stock

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Formix International (Excess)

India . 454 parts In-Stock

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Argo Parts USA

USA . 380 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 34 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unleash the power of precision with the TLV3201AIDBV comparator by Texas Instruments. Crafted with top-notch quality and expertise, this small yet mighty device is designed to deliver unparalleled performance in a wide range of applications. From automotive to industrial, this versatile comparator offers customers the value, benefits, and advantages they need for their projects. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations and pushes boundaries. Elevate your designs with the TLV3201AIDBV and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is durable and helps protect the internal components of the comparator, ensuring reliability and longevity.

Maximum Input Offset Voltage: 6000 uV

The high maximum input offset voltage allows for precise and accurate comparisons, making this comparator suitable for applications where precision is crucial.

Maximum Average Bias Current (IIB): 0.005 uA

The low maximum average bias current ensures minimal power consumption, making this comparator energy-efficient and ideal for battery-operated devices.

Surface Mount: YES

Being surface mountable, this comparator is easy to integrate onto PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is common and compatible with many standard power sources, making this comparator versatile and easy to use in various applications.

No. of Terminals: 5

With a compact design and only 5 terminals, this comparator is space-efficient and suitable for applications with limited board space.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and allows for easy soldering, ensuring reliable performance of the comparator in different operating conditions.

Technical Specifications

Comparators TLV3201AIDBV attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

6 mV

Peak Bias Current:

5 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

47 ns

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G5

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Trade Compliance

TLV3201AIDBV Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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