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LMC7221BIM5X

Texas Instruments

LMC7221BIM5X by Texas Instruments

LMC7221BIM5X by Texas Instruments is a CMOS comparator with 18000 uV max input offset voltage and 0.00000004 uA max average bias current. Ideal for industrial applications, it operates b/w -40 to 85 °C with a supply voltage range of 2.7-15 V. Package style is small outline, low profile, shrink pitch.

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Adafruit Industries

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Ampacity Inc.

Singapore . 84 parts In-Stock

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$0.410

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Semicontronic

India . 84 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 122 parts In-Stock

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ChromeModa Solutions

Germany . 4,566 parts In-Stock

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IDEA Electronic Components Group

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Overview

Discover the precision and reliability of the LMC7221BIM5X comparator by Texas Instruments. With a reputation for excellence, Texas Instruments delivers top-quality products that meet the highest industry standards. This small outline, low profile device is ideal for a variety of applications, offering fast response times and efficient performance. Trust in Texas Instruments to provide you with the value and benefits you need to succeed in your projects. Experience the advantage of using the LMC7221BIM5X and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the comparator, ensuring a longer lifespan.

Maximum Input Offset Voltage: 18000 uV

The low input offset voltage allows for accurate comparison of input signals, making this comparator suitable for precision applications.

Maximum Average Bias Current (IIB): 0.00000004 uA

The low bias current helps minimize power consumption and maintain signal integrity in the circuit.

Surface Mount: YES

The surface mount capability makes it easy to integrate this comparator into compact circuit designs, saving space and simplifying assembly.

Maximum Supply Voltage Limit: 16 V

With a high supply voltage limit, this comparator can handle a wide range of power supply inputs, increasing its versatility in different applications.

Output Type: OPEN-DRAIN

The open-drain output allows for flexible interfacing with other devices and enables the comparator to sink current, enhancing its compatibility with various systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast response times, making this comparator efficient and reliable in operation.

Technical Specifications

Comparators LMC7221BIM5X attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

2.7/15 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

18 mV

Peak Bias Current:

0.04 pA

Operational Characteristics

Maximum Supply Current:

18 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16 V

Nominal Negative Supply Voltage (Vsup):

0 V

Maximum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

7 µs

Physical Characteristics

Length:

0.115 in (2.92 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.048 in (1.22 mm)

Total Terminals:

5

Terminal Pitch:

0.038 in (0.953 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin Lead

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

LMC7221BIM5X Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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