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TLV1391CDBVTE4

Texas Instruments

TLV1391CDBVTE4 by Texas Instruments

TLV1391CDBVTE4 by Texas Instruments is a comparator with 9000uV max input offset voltage, -0.4uA max average bias current, and 700ns nominal response time. Ideal for applications requiring precise voltage comparisons in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,618 parts In-Stock

1+ parts

-

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3,618

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Digiode

USA . 2,540 parts In-Stock

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2,540

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 762 parts In-Stock

1+ parts

$4.041

100+ parts

-

1k+ parts

$4.504

10k+ parts

-

762

$4.041

-

$4.504

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DigiPath Technology Company

USA . 1,026 parts In-Stock

1+ parts

$4.449

100+ parts

-

1k+ parts

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1,026

$4.449

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ChromeModa Solutions

Germany . 6,008 parts In-Stock

1+ parts

$4.540

100+ parts

$3.723

1k+ parts

-

10k+ parts

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6,008

$4.540

$3.723

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IDEA Electronic Components Group

UK . 12 parts In-Stock

1+ parts

$4.540

100+ parts

-

1k+ parts

$4.086

10k+ parts

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12

$4.540

-

$4.086

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One Stop Electronics

USA . 1,439 parts In-Stock

1+ parts

$5.410

100+ parts

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1,439

$5.410

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Advanced Electronics

New Zealand . 18 parts In-Stock

1+ parts

$7.648

100+ parts

$6.960

1k+ parts

$6.271

10k+ parts

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18

$7.648

$6.960

$6.271

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$19.643

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425

$19.643

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Corphita

USA . 3,299 parts In-Stock

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3,299

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Microchip USA

USA . 244 parts In-Stock

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244

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Overview

Discover the exceptional quality and reliability of the TLV1391CDBVTE4 by Texas Instruments, a leading manufacturer in the industry. As part of the comparators category, this product offers unmatched precision and performance for a wide range of applications. With its compact package body material and low power consumption, customers can expect efficient and accurate results in their projects. Trust in Texas Instruments to deliver cutting-edge technology that meets the demands of today's fast-paced market. Experience the value and benefits of this top-of-the-line comparator and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, making this comparator suitable for various environments and applications.

Maximum Input Offset Voltage: 9000 uV

The high maximum input offset voltage allows for accurate comparison of input signals with minimal error, ensuring reliable performance.

Surface Mount: YES

The surface mount capability makes it easy to integrate this comparator onto PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3

The nominal supply voltage of 3V ensures compatibility with common power sources, making it a versatile choice for different applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this comparator can withstand a wide range of operating conditions, increasing its reliability.

Technical Specifications

Comparators TLV1391CDBVTE4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

3/5 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

9 mV

Peak Bias Current:

-400 nA

Maximum Bias Current (IIB) @25 °C:

250 nA

Operational Characteristics

Maximum Supply Current:

150 μA

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

700 ns

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

5

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP5/6,.11,37

Trade Compliance

TLV1391CDBVTE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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