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TLE2426MD

Texas Instruments

TLE2426MD by Texas Instruments

TLE2426MD by Texas Instruments is a small outline, surface mount IC with 1 function. It operates at a nominal voltage of 5V and has a max operating temperature of 125°C. This analog circuit is commonly used in military applications.

Median Price

$5.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,002 parts In-Stock

1+ parts

$5.040

100+ parts

$2.570

1k+ parts

$2.190

10k+ parts

$1.890

2,002

$5.040

$2.570

$2.190

$1.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$1.322

100+ parts

-

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-

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750

$1.322

-

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Digiode

USA . 3,210 parts In-Stock

1+ parts

$2.480

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-

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3,210

$2.480

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Vyrian

USA . 1,880 parts In-Stock

1+ parts

-

100+ parts

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1,880

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-

-

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Chip Stock

USA . 525 parts In-Stock

1+ parts

-

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525

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Inventory MP

USA . 7 parts In-Stock

1+ parts

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7

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Bristol Electronics

USA . 7 parts In-Stock

1+ parts

-

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,450 parts In-Stock

1+ parts

$1.322

100+ parts

-

1k+ parts

-

10k+ parts

$1.295

2,450

$1.322

-

-

$1.295

Argo Parts USA

USA . 883 parts In-Stock

1+ parts

$1.322

100+ parts

-

1k+ parts

-

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-

883

$1.322

-

-

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Netroflash

USA . 500 parts In-Stock

1+ parts

$1.322

100+ parts

-

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500

$1.322

-

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Ampacity Inc.

Singapore . 1,866 parts In-Stock

1+ parts

$2.220

100+ parts

-

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1,866

$2.220

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Corphita

USA . 2,355 parts In-Stock

1+ parts

$2.349

100+ parts

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2,355

$2.349

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Semicontronic

India . 1,490 parts In-Stock

1+ parts

$2.510

100+ parts

$2.447

1k+ parts

$2.435

10k+ parts

-

1,490

$2.510

$2.447

$2.435

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Parana Technologies

USA . 1,595 parts In-Stock

1+ parts

$10.318

100+ parts

-

1k+ parts

$10.841

10k+ parts

-

1,595

$10.318

-

$10.841

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DigiPath Technology Company

USA . 2,373 parts In-Stock

1+ parts

$11.361

100+ parts

$10.452

1k+ parts

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10k+ parts

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2,373

$11.361

$10.452

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ChromeModa Solutions

Germany . 2,155 parts In-Stock

1+ parts

$11.593

100+ parts

$9.506

1k+ parts

-

10k+ parts

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2,155

$11.593

$9.506

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IDEA Electronic Components Group

UK . 526 parts In-Stock

1+ parts

$11.593

100+ parts

$11.013

1k+ parts

$10.434

10k+ parts

-

526

$11.593

$11.013

$10.434

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Corohmni

South Africa . 18 parts In-Stock

1+ parts

$12.743

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18

$12.743

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Microchip USA

USA . 5,092 parts In-Stock

1+ parts

$16.965

100+ parts

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5,092

$16.965

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A-Z Elektronik GmbH

Germany . 4,850 parts In-Stock

1+ parts

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4,850

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Perfect Parts

USA . 1,231 parts In-Stock

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1,231

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Overview

Boost your electronic projects with the TLE2426MD by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality products that meet the highest standards. The TLE2426MD is an exceptional choice for various applications in the semiconductor field. With its compact size and surface-mount capabilities, this small outline package offers convenience and flexibility. Operating at a wide temperature range and with a minimum supply voltage of 4V, this analog circuit ensures reliable performance in any environment. Whether you're working on power supplies or other function semiconductors, the TLE2426MD delivers unmatched value, benefits, and advantages to enhance your projects. Experience the difference with Texas Instruments today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This material provides durability and protection for the product, making it suitable for various environments.

Surface Mount:

YES. This feature allows for easy and efficient PCB assembly, saving time and increasing productivity.

No. of Functions:

1. This product offers a single function, simplifying its usage and integration into different systems.

Package Shape:

RECTANGULAR. The rectangular shape ensures compatibility with standardized mounting and assembly processes.

Nominal Supply Voltage (Vsup):

5 V. The 5V supply voltage provides a stable and reliable power source for the product's operation.

Power Supplies (V):

5/12. This product supports multiple power supply voltages, allowing flexibility and compatibility with different systems.

No. of Terminals:

8. With 8 terminals, this product offers sufficient connectivity options for various applications.

Package Style (Meter):

SMALL OUTLINE. The small outline package style enables space-saving integration, especially in compact designs.

Maximum Operating Temperature:

125 °C. The high maximum operating temperature ensures the product's robustness and reliable performance even in demanding environments.

Minimum Operating Temperature:

55 °C. The low minimum operating temperature allows the product to function accurately in extreme cold conditions.

Terminal Finish:

NICKEL PALLADIUM GOLD. The nickel palladium gold terminal finish ensures excellent conductivity and resistance to corrosion, resulting in improved signal integrity and product longevity.

Terminal Position:

DUAL. The dual terminal position offers flexibility in the product's installation and connection options.

Maximum Seated Height:

1.75 mm. The low maximum seated height facilitates compact designs and allows for efficient space utilization.

Width (mm):

3.9 mm. With a narrow width, this product takes up minimal board space, enabling higher packing densities in circuit layouts.

Other IC type:

ANALOG CIRCUIT. This product being an analog circuit type enables precise signal processing and amplification, making it suitable for various analog applications.

Minimum Supply Voltage (Vsup):

4 V. With a low minimum supply voltage, this product is compatible with power-limited systems, expanding its range of applications.

Maximum Time At Peak Reflow Temperature (s):

30. The maximum time at peak reflow temperature ensures proper soldering and reliable connection during the manufacturing process.

Peak Reflow Temperature °C:

260. The high peak reflow temperature ensures proper soldering and robust assembly of the product.

Length:

4.9 mm. The compact length of this product emphasizes its space-saving nature and suitability for miniaturized designs.

Temperature Grade:

MILITARY. This product is designed to meet military-grade temperature requirements, ensuring reliability in harsh operating conditions.

Maximum Supply Current (Isup):

0.25 mA. With a low maximum supply current, this product is power-efficient, particularly useful for battery-powered applications.

No. of Channels:

1. The single channel configuration simplifies the product's setup and implementation, making it an efficient choice for specific applications.

Terminal Form:

GULL WING. The gull wing terminal form ensures reliable solder joints and ease of assembly, contributing to the product's overall performance and reliability.

Terminal Pitch:

1.27 mm. The standard terminal pitch enhances compatibility with existing PCB layouts and facilitates straightforward integration.

Moisture Sensitivity Level (MSL):

1. The moisture sensitivity level 1 indicates that this product is moisture resistant, making it suitable for humid environments.

Maximum Supply Voltage (Vsup):

40 V. With a high maximum supply voltage, this product can handle higher voltage applications, expanding its range of potential uses.

Technical Specifications

Other Function Semiconductors TLE2426MD attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.25 mA

Maximum Supply Voltage (Vsup):

40 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TLE2426MD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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