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TLE2144IDWR

Texas Instruments

TLE2144IDWR by Texas Instruments

TLE2144IDWR by Texas Instruments is a 4-function operational amplifier with max input offset voltage of 3200uV, min slew rate of 27V/us, and nominal unity gain bandwidth of 6000kHz. Ideal for industrial applications requiring high precision amplification in compact spaces due to its small outline package style and low bias current.

Median Price

$2.008

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$2.008

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200

$2.008

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Vyrian

USA . 4,994 parts In-Stock

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Chip Stock

USA . 3,167 parts In-Stock

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Digiode

USA . 2,514 parts In-Stock

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Continental Prestige Electronics

USA . 3,221 parts In-Stock

1+ parts

$2.008

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$1.968

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$2.008

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$1.968

Argo Parts USA

USA . 2,853 parts In-Stock

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$2.008

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2,853

$2.008

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One Stop Electronics

USA . 574 parts In-Stock

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$2.410

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574

$2.410

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Corohmni

South Africa . 358 parts In-Stock

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$2.610

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358

$2.610

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Parana Technologies

USA . 792 parts In-Stock

1+ parts

$2.849

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$3.339

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$2.849

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$3.339

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DigiPath Technology Company

USA . 448 parts In-Stock

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$3.137

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$3.137

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ChromeModa Solutions

Germany . 3,958 parts In-Stock

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$3.201

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$2.625

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$3.201

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IDEA Electronic Components Group

UK . 1,750 parts In-Stock

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$3.201

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$2.881

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Semicontronic

India . 373 parts In-Stock

1+ parts

$7.410

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$7.225

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$7.188

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373

$7.410

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Ampacity Inc.

Singapore . 555 parts In-Stock

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$8.410

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AZTECH Wire

Italy . 589 parts In-Stock

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$16.663

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Microchip USA

USA . 2,957 parts In-Stock

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$17.880

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Kepictronics

USA . 5,320 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,208 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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SIE Connect GmbH (Excess)

Germany . 740 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.968

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$1.908

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$1.867

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$1.908

$1.867

Corphita

USA . 408 parts In-Stock

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Overview

Elevate your electronic designs with the TLE2144IDWR by Texas Instruments. Crafted with precision and reliability, this operational amplifier offers unparalleled performance in a compact package. Whether you're working on audio equipment, sensor interfaces, or precision measurement systems, this op amp delivers exceptional value with its high voltage capabilities and low power consumption. Trust Texas Instruments to provide top-tier components for your next project. Advance your designs with the TLE2144IDWR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making the product long-lasting.

Maximum Input Offset Voltage: 3200 uV

Low offset voltage ensures accurate and precise amplifier operation.

Maximum Average Bias Current (IIB): -1.7 uA

Low bias current helps in minimizing power consumption and ensures stability in signal amplification.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

No. of Functions: 4

Versatile amplifier with multiple functions for various applications.

Nominal Common Mode Reject Ratio: 108 dB

High common mode rejection ratio reduces noise interference in the output signal.

Nominal Supply Voltage / Vsup (V): 15

Works efficiently within the specified voltage range, ensuring reliable performance.

Minimum Slew Rate: 27 V/us

Fast slew rate facilitates quick response in signal processing.

Frequency Compensation: YES

Stability in frequency response and improved performance in various frequency ranges.

Maximum Supply Current: 18 mA

Suitable for applications requiring higher current output without compromising performance.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2144IDWR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

6 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

108 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

3200 uV

Minimum Voltage Gain:

40000

Minimum Slew Rate:

27 V/us

Nominal Slew Rate:

45 V/us

Maximum Input Offset Current (IIO):

100 nA

Peak Bias Current:

-1.7 uA

Maximum Bias Current (IIB) @25 °C:

1.5 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

18 mA

Physical Characteristics

Length:

0.406 in (10.3 mm)

Width:

0.295 in (7.5 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Total Terminals:

16

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP16,.4

Trade Compliance

TLE2144IDWR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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