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TLE2027MDG4

Texas Instruments

TLE2027MDG4 by Texas Instruments

TLE2027MDG4 by Texas Instruments is an Operational Amplifier with 200uV Max Input Offset Voltage, 131dB Nominal CMRR, and 1V/us Min Slew Rate. Ideal for military applications due to -55 to 125 °C operating temp range and MIL-Grade technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,362 parts In-Stock

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Digiode

USA . 2,818 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 533 parts In-Stock

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$5.410

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533

$5.410

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Parana Technologies

USA . 2,246 parts In-Stock

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$5.936

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$551.276

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$5.343

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DigiPath Technology Company

USA . 2,102 parts In-Stock

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$6.537

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$6.537

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IDEA Electronic Components Group

UK . 1,748 parts In-Stock

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$6.670

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$6.003

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ChromeModa Solutions

Germany . 1,316 parts In-Stock

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$6.670

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$5.469

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$6.670

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AZTECH Wire

Italy . 820 parts In-Stock

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$14.007

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QUARKTWIN TECHNOLOGY LTD

USA . 27,508 parts In-Stock

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Corphita

USA . 3,241 parts In-Stock

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Microchip USA

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Overview

Unlock the potential of precision and reliability with the TLE2027MDG4 operational amplifier by Texas Instruments. Crafted with top-tier technology and expertise, this small outline device delivers unparalleled performance in a wide range of applications. From audio equipment to industrial control systems, this op amp provides low-offset and high common mode rejection for superior accuracy. Trust in Texas Instruments to bring you quality components that exceed expectations, setting new standards in efficiency and functionality. Elevate your projects with the TLE2027MDG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, making it suitable for various applications.

Maximum Input Offset Voltage: 200 uV

Low input offset voltage ensures high precision and accuracy in signal processing, making it ideal for sensitive circuitry.

Nominal Common Mode Reject Ratio: 131 dB

High common mode rejection ratio helps in rejecting noise and interference from the input signal, resulting in clean and accurate output.

Nominal Supply Voltage / Vsup (V): 15

With a nominal supply voltage of 15V, this op amp is suitable for a wide range of applications requiring moderate power.

Frequency Compensation: YES

Frequency compensation improves stability and reduces oscillations, making the op amp reliable in various operating conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this op amp can withstand elevated temperatures in harsh environments.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2027MDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

13 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

131 dB

Input Offset Voltage Limit:

200 uV

Minimum Slew Rate:

1 V/us

Nominal Slew Rate:

2.8 V/us

Peak Bias Current:

150 nA

Maximum Bias Current (IIB) @25 °C:

90 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

19 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-19 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

5.6 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLE2027MDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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