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TLE2024QDWRQ1

Texas Instruments

TLE2024QDWRQ1 by Texas Instruments

TLE2024QDWRQ1 by Texas Instruments is a micropower operational amplifier with 4 functions, offering a max input offset voltage of 1200 uV and nominal common mode reject ratio of 102 dB. Ideal for automotive applications due to AEC-Q100 screening level, it operates in temperature range -40 to 125 °C with low bias current of 0.07 uA @25C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,663 parts In-Stock

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Digiode

USA . 4,752 parts In-Stock

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Chip Stock

USA . 3,740 parts In-Stock

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Parana Technologies

USA . 1,707 parts In-Stock

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$0.919

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$1.837

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DigiPath Technology Company

USA . 1,189 parts In-Stock

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$1.012

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$0.931

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$1.012

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ChromeModa Solutions

Germany . 2,389 parts In-Stock

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$1.033

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$0.847

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IDEA Electronic Components Group

UK . 1,672 parts In-Stock

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$1.033

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$0.930

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One Stop Electronics

USA . 1,341 parts In-Stock

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$5.410

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AZTECH Wire

Italy . 260 parts In-Stock

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$18.550

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QUARKTWIN TECHNOLOGY LTD

USA . 10,815 parts In-Stock

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Microchip USA

USA . 5,714 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Corphita

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Overview

Enhance your automotive applications with the TLE2024QDWRQ1 by Texas Instruments, a high-quality operational amplifier designed to deliver optimal performance. With Texas Instruments' reputation for excellence in manufacturing, this Op Amp offers customers reliability and precision. Perfect for a variety of automotive systems, this product provides superior functionality and efficiency. Experience the value of seamless operation and enhanced performance with the TLE2024QDWRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 1200 uV

Low offset voltage ensures accurate and precise signal processing.

Maximum Average Bias Current (IIB): 0.09 uA

Low bias current minimizes power consumption and improves overall efficiency.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards.

Nominal Common Mode Reject Ratio: 102 dB

Provides high rejection of common-mode signals, ensuring accurate differential signal amplification.

Nominal Supply Voltage (Vsup): 15 V

Operates reliably within the specified supply range.

Minimum Slew Rate: 0.4 V/us

Fast slew rate allows for rapid response to input signal changes.

Minimum Voltage Gain: 100000

High voltage gain amplifies small input signals effectively.

Nominal Unity Gain Bandwidth: 2800 kHz

Provides high bandwidth for signal amplification without distortion.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2024QDWRQ1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±2/±20/4/40 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

2.8 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

102 dB

Input Offset Voltage Limit:

1200 uV

Minimum Voltage Gain:

100000

Minimum Slew Rate:

0.4 V/us

Nominal Slew Rate:

0.7 V/us

Peak Bias Current:

90 nA

Maximum Bias Current (IIB) @25 °C:

70 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

20 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-20 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

1.4 mA

Physical Characteristics

Length:

0.406 in (10.3 mm)

Width:

0.295 in (7.5 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Total Terminals:

16

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G16

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP16,.4

Trade Compliance

TLE2024QDWRQ1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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