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TLE2022MDG4

Texas Instruments

TLE2022MDG4 by Texas Instruments

TLE2022MDG4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 600uV, nominal voltage of +/-15V, and unity gain bandwidth of 1700kHz. Ideal for military-grade applications requiring precise signal amplification in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,810 parts In-Stock

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Digiode

USA . 717 parts In-Stock

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717

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Nova Conductors

Japan . 55 parts In-Stock

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One Stop Electronics

USA . 289 parts In-Stock

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$0.410

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289

$0.410

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Corohmni

South Africa . 993 parts In-Stock

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$2.198

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993

$2.198

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Ampacity Inc.

Singapore . 760 parts In-Stock

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$2.410

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Parana Technologies

USA . 598 parts In-Stock

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$6.263

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$7.019

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$7.019

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ChromeModa Solutions

Germany . 1,114 parts In-Stock

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$7.037

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$5.770

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IDEA Electronic Components Group

UK . 564 parts In-Stock

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$7.037

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$6.333

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AZTECH Wire

Italy . 503 parts In-Stock

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Continental Prestige Electronics

USA . 5,560 parts In-Stock

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Corphita

USA . 2,628 parts In-Stock

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Argo Parts USA

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Microchip USA

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DigiPath Technology Company

USA . 452 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Discover the powerful performance and precision of the TLE2022MDG4 Operational Amplifier by Texas Instruments. Crafted with top-notch quality and reliability, this versatile op amp offers unparalleled benefits for a wide range of applications. From audio amplification to signal conditioning, this small outline device delivers exceptional value with low-offset, micropower operation, and high voltage gain bandwidth. Trust in Texas Instruments to provide innovative solutions that exceed expectations and elevate your designs to new heights. Experience the difference with the TLE2022MDG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it a reliable choice for various applications.

Maximum Input Offset Voltage: 600 uV

The low input offset voltage ensures accurate signal processing, making it suitable for precision instrumentation.

Maximum Average Bias Current (IIB): 0.09 uA

With low bias current, this Op Amp minimizes power consumption and provides stable operation in low power applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, ideal for compact electronic devices.

No. of Functions: 2

Offering multiple functions in one component enhances versatility and efficiency in circuit design.

Nominal Common Mode Reject Ratio: 100 dB

High common mode rejection ratio ensures minimal interference from unwanted signals, improving signal integrity.

Nominal Supply Voltage / Vsup (V): 15

The nominal supply voltage of 15V provides flexibility and compatibility with a wide range of power sources.

Power Supplies (V): +-2/+-20/4/40

Accommodating various power supply voltages allows for versatile use in different electronic systems.

No. of Terminals: 8

The 8 terminals provide ample connectivity options for interfacing with external components in a circuit.

Maximum Input Offset Current (IIO): 0.006 uA

Low input offset current ensures minimal input errors and accurate measurement capabilities.

Technical Specifications

Operational Amplifiers (Op Amps) TLE2022MDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±2/±20/4/40 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

Yes

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

100 dB

Minimum Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

600 uV

Minimum Voltage Gain:

800000

Minimum Slew Rate:

0.4 V/us

Nominal Slew Rate:

0.5 V/us

Maximum Input Offset Current (IIO):

6 nA

Peak Bias Current:

90 nA

Maximum Bias Current (IIB) @25 °C:

70 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

20 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-20 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

600 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLE2022MDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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