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TLC5949DBQ

Texas Instruments

TLC5949DBQ by Texas Instruments

TLC5949DBQ by Texas Instruments is a LED display driver with 24 terminals, operating at 3.3V. It has a temperature range of -40 to 85°C and uses GULL WING terminal form for industrial applications. The package is rectangular, surface mountable, and made of PLASTIC/EPOXY material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,139

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-

-

-

Vyrian

USA . 2,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,179 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,179

$1.500

-

-

-

Parana Technologies

USA . 825 parts In-Stock

1+ parts

$4.582

100+ parts

-

1k+ parts

$5.039

10k+ parts

-

825

$4.582

-

$5.039

-

DigiPath Technology Company

USA . 1,904 parts In-Stock

1+ parts

$5.045

100+ parts

-

1k+ parts

-

10k+ parts

-

1,904

$5.045

-

-

-

IDEA Electronic Components Group

UK . 1,041 parts In-Stock

1+ parts

$5.148

100+ parts

-

1k+ parts

$4.633

10k+ parts

-

1,041

$5.148

-

$4.633

-

ChromeModa Solutions

Germany . 468 parts In-Stock

1+ parts

$5.148

100+ parts

$4.221

1k+ parts

-

10k+ parts

-

468

$5.148

$4.221

-

-

AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$13.751

100+ parts

-

1k+ parts

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10k+ parts

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218

$13.751

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-

-

Corphita

USA . 3,265 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,265

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Microchip USA

USA . 261 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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261

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Overview

Enhance your display designs with the TLC5949DBQ by Texas Instruments. Crafted with precision and expertise, this graphics display driver offers unparalleled quality and reliability. Perfect for a wide range of applications, this product provides exceptional value and benefits to customers seeking top-notch performance and efficiency. Elevate your projects with the TLC5949DBQ and experience the advantages of Texas Instruments technology at its finest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, saving time and effort during assembly.

Power Supplies (V): 3.3

Operating at 3.3V ensures compatibility with standard power supplies and reduces the risk of damage from incorrect voltage.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperature environments without compromising performance.

Nominal Supply Voltage: 3.3 V

Having a nominal supply voltage of 3.3V ensures stable and consistent power delivery to the product, enhancing reliability.

Interface IC Type: LED DISPLAY DRIVER

Specifically designed for LED display drivers, this product offers optimized performance and compatibility for driving LED displays efficiently.

Technical Specifications

Graphics Display Drivers TLC5949DBQ attributes and parameters. Explore more Graphics Display Drivers devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.24

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Display Drivers

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TLC5949DBQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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