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TLC556CN3

Texas Instruments

TLC556CN3 by Texas Instruments

TLC556CN3 by Texas Instruments is an Analog Waveform Generation IC with 14 terminals, operating at 0-70°C. It has dual terminal position, CMOS technology, and operates on power supplies of 5/18V. Ideal for applications requiring precise waveform generation in commercial temperature grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,737 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,737

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Digiode

USA . 674 parts In-Stock

1+ parts

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-

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674

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,470 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,470

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,649 parts In-Stock

1+ parts

$3.500

100+ parts

-

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10k+ parts

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1,649

$3.500

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Ampacity Inc.

Singapore . 795 parts In-Stock

1+ parts

$4.500

100+ parts

-

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795

$4.500

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Parana Technologies

USA . 1,422 parts In-Stock

1+ parts

$12.395

100+ parts

$1,151.067

1k+ parts

$11.156

10k+ parts

-

1,422

$12.395

$1,151.067

$11.156

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DigiPath Technology Company

USA . 1,455 parts In-Stock

1+ parts

$13.648

100+ parts

-

1k+ parts

-

10k+ parts

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1,455

$13.648

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ChromeModa Solutions

Germany . 4,539 parts In-Stock

1+ parts

$13.927

100+ parts

$11.420

1k+ parts

-

10k+ parts

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4,539

$13.927

$11.420

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IDEA Electronic Components Group

UK . 756 parts In-Stock

1+ parts

$13.927

100+ parts

$13.231

1k+ parts

$12.534

10k+ parts

-

756

$13.927

$13.231

$12.534

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AZTECH Wire

Italy . 836 parts In-Stock

1+ parts

$14.868

100+ parts

-

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836

$14.868

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Corphita

USA . 1,086 parts In-Stock

1+ parts

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1,086

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Corohmni

South Africa . 253 parts In-Stock

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253

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Overview

Unlock endless possibilities with the TLC556CN3 by Texas Instruments, a premium analog waveform generation device crafted with precision and expertise. Perfect for a wide range of applications, this product offers unparalleled value and benefits to customers seeking reliable performance and seamless integration. Elevate your projects with the TLC556CN3 and experience the quality and innovation that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making it suitable for various environments.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement in electronic circuits and systems.

Power Supplies (V): 5/18

Offers flexibility in power supply options, allowing for compatibility with different systems and applications.

No. of Terminals: 14

Provides ample connectivity options for interfacing with other components and devices in a circuit.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and facilitates neat and organized circuit board layouts.

Maximum Operating Temperature: 70 °C

Can operate efficiently in a wide range of temperatures, ensuring reliability under varying environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning reliably even in low-temperature environments, enhancing its versatility.

Terminal Position: DUAL

The dual terminal position allows for convenient connection options, enhancing usability and flexibility.

Temperature Grade: COMMERCIAL

Suitable for commercial applications, ensuring performance consistency and reliability in everyday use.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of systems.

Terminal Form: THROUGH-HOLE

The through-hole terminals simplify assembly and soldering processes, making it user-friendly for circuit integration.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection with standard electronic components, enhancing compatibility.

Technical Specifications

Analog Waveform Generation TLC556CN3 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/18

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TLC556CN3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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