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TLC374MJ

Texas Instruments

TLC374MJ by Texas Instruments

TLC374MJ by Texas Instruments is a CMOS COMPARATOR with 4 functions, 14 terminals, and OPEN-COLLECTOR output. It operates b/w -55 to 125 °C with a response time of 650 ns. Ideal for military-grade applications requiring low bias current and high input offset voltage precision.

Median Price

$6.958

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 14 parts In-Stock

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$6.958

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$7.306

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$6.888

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Digiode

USA . 2,788 parts In-Stock

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Vyrian

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Electro Mavin

USA . 80 parts In-Stock

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Bristol Electronics

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Elcom Components

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One Stop Electronics

USA . 956 parts In-Stock

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$4.410

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Parana Technologies

USA . 951 parts In-Stock

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$5.257

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$5.879

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DigiPath Technology Company

USA . 1,380 parts In-Stock

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$5.789

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ChromeModa Solutions

Germany . 1,829 parts In-Stock

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$5.907

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$4.844

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IDEA Electronic Components Group

UK . 212 parts In-Stock

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AZTECH Wire

Italy . 203 parts In-Stock

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$19.776

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Corphita

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Microchip USA

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Overview

Unlock the power of precision with the Texas Instruments TLC374MJ comparator. Crafted with top-notch quality and cutting-edge technology, this device offers unparalleled performance in a compact package. Ideal for a variety of applications, this comparator delivers fast response times and low power consumption, making it a versatile choice for your next project. Trust in Texas Instruments to provide you with a reliable solution that exceeds expectations. Elevate your designs with the TLC374MJ and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This ensures durability and protection for the internal components, making the product suitable for rugged environments.

Maximum Input Offset Voltage: 10000 uV

High input offset voltage allows for accurate comparison of input signals, making it ideal for precision applications.

Nominal Supply Voltage / Vsup (V): 5

Operates on a standard 5V supply voltage, making it compatible with a wide range of systems and applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for applications where temperature variations occur.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Comparators TLC374MJ attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Collector, Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

20 nA

Maximum Bias Current (IIB) @25 °C:

30 pA

Operational Characteristics

Maximum Supply Current:

600 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

650 ns

Physical Characteristics

Length:

0.77 in (19.56 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin/Lead

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-GDIP-T14

JESD-609 Code:

e0

Packaging and Shipping

Packing Method:

Tube

Package Code:

DIP

Package Shape:

Package Type:

In-Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TLC374MJ Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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