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TLC372CPSRG4

Texas Instruments

TLC372CPSRG4 by Texas Instruments

TLC372CPSRG4 by Texas Instruments is a CMOS technology-based comparator with 2 functions, featuring a max input offset voltage of 6500 uV and a nominal response time of 650 ns. It operates within a temperature range of 0-70 °C and is ideal for applications requiring low bias current and fast response times in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,257 parts In-Stock

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Chip Stock

USA . 3,394 parts In-Stock

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Digiode

USA . 1,249 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 546 parts In-Stock

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$3.188

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$3.710

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546

$3.188

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DigiPath Technology Company

USA . 1,541 parts In-Stock

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$3.510

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$3.230

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$3.510

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ChromeModa Solutions

Germany . 5,870 parts In-Stock

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$3.582

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$2.937

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$3.582

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IDEA Electronic Components Group

UK . 2,134 parts In-Stock

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$3.582

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$3.224

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$3.582

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$3.224

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One Stop Electronics

USA . 350 parts In-Stock

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$5.410

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350

$5.410

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AZTECH Wire

Italy . 701 parts In-Stock

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$11.339

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Corphita

USA . 2,243 parts In-Stock

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Microchip USA

USA . 1,938 parts In-Stock

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Overview

Looking for a reliable solution in comparator technology? Look no further than the TLC372CPSRG4 by Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers a high-quality product that meets the demands of various applications. This compact comparator offers fast response times, low power consumption, and accurate performance, making it an ideal choice for your electronic designs. Trust in Texas Instruments to provide value and innovation with the TLC372CPSRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable electronics.

Maximum Input Offset Voltage: 6500 uV

The high maximum input offset voltage allows for accurate comparison between input signals, ensuring precise operation.

Surface Mount: YES

The surface mount capability simplifies the PCB assembly process and saves space, making it suitable for compact designs.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides compatibility with standard power sources, making it easy to integrate into existing systems.

Output Type: OPEN-DRAIN

The open-drain output type allows for easy interfacing with other digital circuits, enhancing versatility and compatibility.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, ensuring efficient and reliable operation.

Amplifier Type: COMPARATOR

Being a comparator, the device is specifically designed for comparing input voltages and providing a digital output based on the comparison result, making it ideal for applications requiring decision-making functions.

Technical Specifications

Comparators TLC372CPSRG4 attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

6.5 mV

Peak Bias Current:

600 pA

Maximum Bias Current (IIB) @25 °C:

30 pA

Operational Characteristics

Maximum Supply Current:

300 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

650 ns

Physical Characteristics

Length:

0.244 in (6.2 mm)

Width:

0.209 in (5.3 mm)

Maximum Seated Height:

0.079 in (2 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP8,.3

Trade Compliance

TLC372CPSRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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