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TLC339MDR

Texas Instruments

TLC339MDR by Texas Instruments

TLC339MDR by Texas Instruments is a CMOS COMPARATOR with 4 functions, OPEN-COLLECTOR output type, and 10000 uV Max Input Offset Voltage. It operates in a temperature range of -55 to 125 °C and has a small outline package style. Ideal for military applications due to its MILITARY grade and low power consumption of 0.08 mA.

Median Price

$1.354

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

$0.890

100+ parts

$0.870

1k+ parts

$0.850

10k+ parts

-

2,500

$0.890

$0.870

$0.850

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Texas Instruments

USA . 115,516 parts In-Stock

1+ parts

$1.783

100+ parts

$1.473

1k+ parts

$0.796

10k+ parts

-

115,516

$1.783

$1.473

$0.796

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Mouser Electronics

USA . 2,469 parts In-Stock

1+ parts

$2.490

100+ parts

$1.720

1k+ parts

$1.520

10k+ parts

$1.270

2,469

$2.490

$1.720

$1.520

$1.270

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.924

2,500

-

-

-

$0.924

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,862 parts In-Stock

1+ parts

$1.694

100+ parts

-

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2,862

$1.694

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-

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Vyrian

USA . 5,488 parts In-Stock

1+ parts

-

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5,488

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Component Sense

UK . 1,792 parts In-Stock

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-

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1,792

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QIE Inc.

USA . 700 parts In-Stock

1+ parts

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700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,317 parts In-Stock

1+ parts

$1.605

100+ parts

-

1k+ parts

-

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1,317

$1.605

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Parana Technologies

USA . 2,269 parts In-Stock

1+ parts

$5.109

100+ parts

-

1k+ parts

$5.696

10k+ parts

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2,269

$5.109

-

$5.696

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DigiPath Technology Company

USA . 2,038 parts In-Stock

1+ parts

$5.626

100+ parts

$5.176

1k+ parts

-

10k+ parts

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2,038

$5.626

$5.176

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ChromeModa Solutions

Germany . 5,505 parts In-Stock

1+ parts

$5.741

100+ parts

$4.708

1k+ parts

-

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5,505

$5.741

$4.708

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IDEA Electronic Components Group

UK . 1,289 parts In-Stock

1+ parts

$5.741

100+ parts

-

1k+ parts

$5.167

10k+ parts

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1,289

$5.741

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$5.167

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Microchip USA

USA . 4,755 parts In-Stock

1+ parts

$7.194

100+ parts

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4,755

$7.194

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QUARKTWIN TECHNOLOGY LTD

USA . 13,279 parts In-Stock

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13,279

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 2,677 parts In-Stock

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2,677

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Overview

Experience the superior quality and reliability of the TLC339MDR comparator by Texas Instruments. Designed with precision and innovation, this product offers unmatched performance in a compact package. Ideal for a variety of applications, the TLC339MDR delivers fast response times and low power consumption, making it a versatile solution for your electronic projects. Trust in Texas Instruments to provide you with cutting-edge technology that exceeds your expectations. Elevate your designs with the TLC339MDR and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Maximum Input Offset Voltage: 10000 uV

High maximum input offset voltage ensures accurate and precise comparison between input signals.

Maximum Average Bias Current (IIB): 0.03 uA

Low average bias current helps in minimizing power consumption and reducing errors in signal comparison.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing production time.

No. of Functions: 4

Multiple functions in a single device provide versatility and flexibility in circuit design and implementation.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V is common and easily available, making it compatible with a wide range of power sources.

Maximum Supply Voltage Limit: 18 V

High maximum supply voltage limit allows for compatibility with different power supply configurations.

Output Type: OPEN-COLLECTOR

Open-collector output type allows for easy integration with other circuit components and devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the comparator efficient and reliable.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable performance in harsh environmental conditions and extreme temperatures.

Technical Specifications

Comparators TLC339MDR attributes and parameters. Explore more Comparators devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Power Supply:

5 V

Total Functions:

4

Sub-Category:

Comparators

Output Type:

Open-Collector

Performance Specifications

Maximum Input Offset Voltage:

10 mV

Peak Bias Current:

30 nA

Maximum Bias Current (IIB) @25 °C:

2 pA

Operational Characteristics

Maximum Supply Current:

80 μA

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

2.5 µs

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Type:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC339MDR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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