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TLC27L4BIDG4

Texas Instruments

TLC27L4BIDG4 by Texas Instruments

TLC27L4BIDG4 by Texas Instruments is a CMOS Operational Amplifier with 4 functions, offering low bias current (0.002 uA) and high common mode rejection ratio (94 dB). Ideal for industrial applications requiring micropower consumption and precise voltage feedback amplification.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,155 parts In-Stock

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3,155

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Vyrian

USA . 2,472 parts In-Stock

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2,472

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 395 parts In-Stock

1+ parts

$4.156

100+ parts

-

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$4.600

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395

$4.156

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$4.600

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DigiPath Technology Company

USA . 922 parts In-Stock

1+ parts

$4.577

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922

$4.577

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ChromeModa Solutions

Germany . 3,499 parts In-Stock

1+ parts

$4.670

100+ parts

$3.829

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3,499

$4.670

$3.829

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IDEA Electronic Components Group

UK . 557 parts In-Stock

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$4.670

100+ parts

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$4.203

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557

$4.670

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$4.203

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One Stop Electronics

USA . 996 parts In-Stock

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$8.410

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996

$8.410

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AZTECH Wire

Italy . 360 parts In-Stock

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$8.553

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360

$8.553

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Corphita

USA . 4,311 parts In-Stock

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Microchip USA

USA . 2,560 parts In-Stock

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Overview

Experience superior performance and reliability with the TLC27L4BIDG4 operational amplifier by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers high-quality products that are ideal for a wide range of applications. From industrial to consumer electronics, this op amp offers exceptional value with its low bias current, micropower technology, and wide temperature range. Trust in Texas Instruments for innovative solutions that elevate your designs and deliver unparalleled results. Elevate your projects with the TLC27L4BIDG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for a variety of applications.

Maximum Input Offset Voltage: 3500 uV

The low maximum input offset voltage ensures accurate performance in signal processing applications.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards and saves space in the overall design.

Nominal Common Mode Reject Ratio: 94 dB

The high common mode reject ratio ensures minimal noise interference in signal processing, resulting in clearer output signals.

Nominal Supply Voltage / Vsup (V): 10

The nominal supply voltage of 10V provides a stable power source for consistent performance.

Minimum Slew Rate: 0.02 V/us

The fast slew rate allows for quick response to input signal changes, making the product suitable for dynamic applications.

Minimum Voltage Gain: 50000

With a high minimum voltage gain, the product can amplify weak input signals effectively for improved output.

Technology: CMOS

The CMOS technology used in the product offers low power consumption and high noise immunity, making it energy-efficient and reliable.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is versatile and can be used in a wide range of applications such as signal conditioning and filtering.

Technical Specifications

Operational Amplifiers (Op Amps) TLC27L4BIDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

5/10 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

110 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

94 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

3500 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

0.02 V/us

Nominal Slew Rate:

0.03 V/us

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

172 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC27L4BIDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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