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TLC27L2BID

Texas Instruments

TLC27L2BID by Texas Instruments

TLC27L2BID by Texas Instruments is a dual operational amplifier with low bias current (0.00006 uA) and micropower feature. It operates at industrial temperature range (-40 to 85 °C) and has a nominal unity gain bandwidth of 85 kHz. Ideal for applications requiring precise signal amplification in compact designs.

Median Price

$0.928

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.928

100+ parts

-

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900

$0.928

-

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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10,000

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Vyrian

USA . 6,636 parts In-Stock

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6,636

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Digiode

USA . 1,842 parts In-Stock

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1,842

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Component Sense

UK . 475 parts In-Stock

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475

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ACDS - Activité Composants Distribution Service

France . 150 parts In-Stock

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150

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Holdelec - ElecDif-Pro

France . 150 parts In-Stock

1+ parts

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150

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LIBRA Elektronik GmbH

Germany . 106 parts In-Stock

1+ parts

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106

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Pride Electronics

USA . 50 parts In-Stock

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50

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Elcom Components

USA . 43 parts In-Stock

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43

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 318 parts In-Stock

1+ parts

$0.410

100+ parts

-

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318

$0.410

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One Stop Electronics

USA . 568 parts In-Stock

1+ parts

$1.410

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568

$1.410

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Microchip USA

USA . 257 parts In-Stock

1+ parts

$2.920

100+ parts

$2.910

1k+ parts

$2.910

10k+ parts

$2.900

257

$2.920

$2.910

$2.910

$2.900

Parana Technologies

USA . 1,813 parts In-Stock

1+ parts

$5.415

100+ parts

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1k+ parts

$6.114

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1,813

$5.415

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$6.114

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ChromeModa Solutions

Germany . 3,190 parts In-Stock

1+ parts

$6.084

100+ parts

$4.989

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3,190

$6.084

$4.989

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IDEA Electronic Components Group

UK . 444 parts In-Stock

1+ parts

$6.084

100+ parts

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1k+ parts

$5.476

10k+ parts

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444

$6.084

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$5.476

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AZTECH Wire

Italy . 810 parts In-Stock

1+ parts

$11.905

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810

$11.905

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Corphita

USA . 4,439 parts In-Stock

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4,439

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Kepictronics

USA . 4,350 parts In-Stock

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Lixinc

USA . 2,982 parts In-Stock

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2,982

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DigiPath Technology Company

USA . 921 parts In-Stock

1+ parts

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$5.485

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921

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$5.485

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Assy Fe

Spain . 316 parts In-Stock

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316

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Overview

Enhance your electronic projects with the TLC27L2BID by Texas Instruments, a top-tier manufacturer known for its quality operational amplifiers. This versatile component is perfect for a wide range of applications, offering precise performance and reliability. With low bias current and micropower capabilities, this op amp provides exceptional value and efficiency while ensuring optimal functionality. Upgrade your designs with the TLC27L2BID and experience superior results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Maximum Input Offset Voltage: 2000 uV

Low input offset voltage ensures accurate and stable operation, important for precision applications.

Maximum Average Bias Current (IIB): 0.002 uA

Low bias current helps in minimizing power consumption and improving overall efficiency of the circuit.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and effort during manufacturing.

Nominal Common Mode Reject Ratio: 94 dB

High common mode rejection ratio helps in reducing noise and interference in the signal, leading to cleaner output.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making the product suitable for battery-powered applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are versatile and widely used in various applications such as signal processing, filtering, and control systems.

Nominal Unity Gain Bandwidth: 85 kHz

High unity gain bandwidth ensures stable performance even at high frequencies, making it ideal for applications requiring fast response.

Technical Specifications

Operational Amplifiers (Op Amps) TLC27L2BID attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

4/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

85 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

94 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

2000 uV

Minimum Voltage Gain:

50000

Minimum Slew Rate:

0.02 V/us

Nominal Slew Rate:

0.03 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

2 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

34 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC27L2BID Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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