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TLC274MDRG4

Texas Instruments

TLC274MDRG4 by Texas Instruments

TLC274MDRG4 by Texas Instruments is a CMOS Operational Amplifier with 4 functions, Vsup of 5V, and low bias current of 0.00006 uA. Ideal for military applications due to MILITARY temperature grade, it offers high common mode rejection ratio and voltage feedback architecture.

Median Price

$1.835

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 70,428 parts In-Stock

1+ parts

$1.835

100+ parts

$1.515

1k+ parts

$0.819

10k+ parts

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70,428

$1.835

$1.515

$0.819

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Distributors (In-Stock)

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Digiode

USA . 4,885 parts In-Stock

1+ parts

$1.743

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4,885

$1.743

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Chip Stock

USA . 5,800 parts In-Stock

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5,800

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Vyrian

USA . 5,182 parts In-Stock

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5,182

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Tectiva GmbH

Germany . 1,993 parts In-Stock

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1,993

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LIBRA Elektronik GmbH

Germany . 668 parts In-Stock

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668

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,269 parts In-Stock

1+ parts

$1.652

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2,269

$1.652

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Parana Technologies

USA . 1,068 parts In-Stock

1+ parts

$6.339

100+ parts

$588.716

1k+ parts

$5.706

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1,068

$6.339

$588.716

$5.706

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DigiPath Technology Company

USA . 2,100 parts In-Stock

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$6.981

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2,100

$6.981

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ChromeModa Solutions

Germany . 6,610 parts In-Stock

1+ parts

$7.123

100+ parts

$5.841

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6,610

$7.123

$5.841

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IDEA Electronic Components Group

UK . 1,290 parts In-Stock

1+ parts

$7.123

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$6.411

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1,290

$7.123

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$6.411

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AZTECH Wire

Italy . 516 parts In-Stock

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$15.620

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516

$15.620

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Perfect Parts

USA . 2,930 parts In-Stock

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2,930

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Microchip USA

USA . 1,901 parts In-Stock

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Overview

Elevate your electronics projects with the TLC274MDRG4 operational amplifier by Texas Instruments. Manufactured with precision and expertise, this high-quality component offers unmatched performance in a variety of applications. Whether you're designing audio equipment, sensor interfaces, or control systems, this versatile op amp delivers exceptional value, reliability, and efficiency. Trust Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Upgrade to the TLC274MDRG4 and experience the difference in your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and can withstand various environmental conditions, making this product long-lasting and reliable.

Maximum Input Offset Voltage: 12000 uV

High maximum input offset voltage ensures accurate amplification of input signals, making this product suitable for precision applications.

Maximum Average Bias Current (IIB): 0.00006 uA

Low bias current ensures minimal power consumption and enhanced signal accuracy in the amplification process.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort in the assembly process.

Nominal Common Mode Reject Ratio: 80 dB

High common mode rejection ratio indicates the ability to suppress undesired common-mode signals, resulting in cleaner output signals.

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into various systems.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows this product to function reliably in harsh environmental conditions, making it suitable for a variety of applications.

Minimum Voltage Gain: 5000

High minimum voltage gain indicates strong amplification capabilities, making this product suitable for applications requiring high signal amplification.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Nominal Unity Gain Bandwidth: 1700 kHz

High unity gain bandwidth indicates wide frequency response, making this product suitable for applications requiring high-frequency operation.

Technical Specifications

Operational Amplifiers (Op Amps) TLC274MDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/16 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.7 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Minimum Common Mode Rejection Ratio (CMRR ):

65 dB

Input Offset Voltage Limit:

12000 uV

Minimum Voltage Gain:

5000

Nominal Slew Rate:

3.6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

6.4 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC274MDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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